Passive alignment using elastic averaging in optoelectronics applications
View Patent ↗In an optoelectronic assembly in which one or more beam paths are to be aligned with a corresponding number of active optical elements, the cooperation between flexible alignment features and fixed alignment features achieves elastic averaging so as to provide the target accuracy. By averaging dimensional and positional errors over a large number of localized couplings of the flexible and fixed alignment features, elastic averaging provides the same accuracy as the more costly and complex kinematic alignment techniques.
1. An optoelectronic assembly comprising:
a coupler having first and second coupling surfaces, said first surface having a first beam port and said second surface having a second beam port, said coupler defining a beam path between said first and second beam ports;
a substrate having an active optical element; and
an elastic averaging alignment arrangement for precisely locating said second beam port of said coupler relative to said active optical element, said elastic averaging alignment arrangement including (1) an array of fixed alignment features comprising electrically inactive solder bumps on one of said coupler and said substrate and (2) a plurality of flexible alignment features on another one of said coupler and said substrate, said fixed alignment features being dedicated to achieving elastic averaging alignment by contact with said flexible alignment features, said flexible alignment features comprising one of compliant plastic, an optically clear plastic, and a polyimide, wherein said flexible alignment features are flexures having a combined configuration based upon a combined configuration of said electrically inactive solder bumps that form said array of fixed alignment features, the flexures forming spaces dimensioned such that individual elements of the array of fixed alignment features have opposing sides contacted by adjacent said flexures.
2. The optoelectronic assembly of claim 1 wherein said active optical element is one of a light source and a light detector, said first coupling surface being generally perpendicular to said second coupling surface.
3. The optoelectronic assembly of claim 2 wherein said first coupling surface includes an array of first beam ports, said second coupling surface includes an array of second beam ports, and the substrate having an array of active optical elements, each of said first beam ports being optically associated with one of said second beam ports by a beam path and being precisely located with respect to one of said active optical elements by said elastic averaging alignment arrangement.
4. The optoelectronic assembly of claim 1 wherein said fixed alignment features are solder bumps that are inactive with respect to conduction of signals.
5. The optoelectronic assembly of claim 4 wherein said flexible alignment features are flexures having a combined configuration based upon a combined configuration of said solder bumps that form said array of fixed alignment features.
6. The optoelectronic assembly of claim 1 wherein said flexible alignment features include flexible standoffs and wherein said fixed alignment features define cavities having a configuration corresponding to said flexible standoffs.
7. The optoelectronic assembly of claim 6 wherein said standoff supports a solder bump, said cavities being dimensioned to receive said solder bumps.
8. The optoelectronic assembly of claim 1 wherein said fixed alignment features include openings in said substrate, said flexible alignment features including flexible projections that are geometrically configured to extend into said openings.
9. The optoelectronic assembly of claim 1 wherein said substrate is a semiconductor substrate and said fixed alignment features are defined on said semiconductor substrate by integrated circuit techniques, said coupler having said flexible alignment features.
10. The optoelectronic assembly of claim 1 wherein said substrate comprises bond pads and said fixed alignment features are solder bumps on said bond pads, said solder bumps being inactive with respect to conduction of signals.
11. The optoelectronic assembly of claim 10 wherein said flexible alignment features are flexures on said coupler, said flexures having surfaces that define spaces for receiving said solder bumps to align said coupler and said substrate by elastic averaging.
12. An optoelectronic assembly comprising:
a coupler having first and second coupling surfaces, said first surface having a first beam port and said second surface having a second beam port, said coupler defining a beam path between said first and second beam ports;
a substrate having an active optical element; and
an elastic averaging alignment arrangement for precisely locating said second beam port of said coupler relative to said active optical element, said elastic averaging alignment arrangement including (1) an array of fixed alignment features on one of said coupler and said substrate and (2) a plurality of flexible alignment features on another one of said coupler and said substrate, said fixed alignment features being dedicated to achieving elastic averaging alignment by cooperation with said flexible alignment features, wherein:
said fixed alignment features are solder bumps that are inactive with respect to conduction of signals;
said flexible alignment features are flexures having a combined configuration based upon a combined configuration of said solder bumps that form said array of fixed alignment features, said combined configuration of flexures forming spaces dimensioned such that individual said solder bumps have opposite sides contacted by adjacent said flexures.
13. The optoelectronic assembly of claim 12 wherein said flexures include first flexures that extend in a direction perpendicular to said second flexures.