Multi-level thin film capacitor on a ceramic substrate

1. A thin film integrated circuit, comprising:

a ceramic substrate;

a thin film multi-level capacitor (MLC) that includes at least one high permittivity dielectric layer between at least two electrode layers, the electrode layers being formed from a conductive thin film material; and

a buffer layer between the ceramic substrate and the thin film MLC, the buffer layer having a smooth surface with a surface roughness (Ra) less than or equal to 0.08 micrometers (um);

wherein the thin film MLC is fabricated on the smooth surface of the buffer layer;

wherein the MLC is a tunable capacitor;

wherein the high permittivity dielectric layer is a compound containing Barium Strontium Titanium Oxide.

2. The thin film integrated circuit of claim 1 , wherein the surface roughness (Ra) of the buffer layer is less than or equal to 0.06 micrometers (um).

3. The thin film integrated circuit of claim 1 , wherein the surface roughness (Ra) of the buffer layer is less than or equal to 0.03 micrometers (um).

4. The thin film integrated circuit of claim 1 , wherein the ceramic substrate is Al 2 O 3 .

5. The thin film integrated circuit of claim 1 , wherein the ceramic substrate is AlN.

6. The thin film integrated circuit of claim 1 , wherein the ceramic substrate is Mg 2 SiO 4 .

7. The thin film integrated circuit of claim 1 , wherein the ceramic substrate is MgTiO 3 .

8. The thin film integrated circuit of claim 1 , wherein the MLC has an overall capacitance density of about 10 fF/um 2 to about 390 fF/um 2 .

9. The thin film integrated circuit of claim 1 , wherein the buffer layer is a polished thick film dielectric material.

10. The thin film integrated circuit of claim 1 , wherein the buffer layer is a fritted glass dielectric material.

11. The thin film integrated circuit of claim 10 , wherein the ceramic substrate includes through holes filled with conductive material and wherein a surface of the ceramic substrate is completely covered by the fritted glass dielectric material.

12. The thin film integrated circuit of claim 10 , wherein the ceramic substrate includes through holes filled with conductive material and wherein a surface of the ceramic substrate is partially covered by flitted glass dielectric material, leaving the through holes uncovered.

13. The thin film integrated circuit of claim 1 , further comprising:

a high density interconnect (HDI) layer between the ceramic substrate and the buffer layer.

14. The thin film integrated circuit of claim 13 , wherein the HDI layer including at least one routing layer and at least one layer of a thick film dielectric material.

15. The thin film integrated circuit of claim 13 , wherein the HDI layer further includes one or more metal filled vias to electrically connect the MLC to metal filled through holes in the ceramic substrate.

16. The thin film integrated circuit of claim 13 , wherein the HDI layer includes one or more buried passive circuit components.

17. The thin film integrated circuit of claim 1 , further comprising:

one or more additional passive thin film devices coupled to the MLC.

18. The thin film integrated circuit of claim 1 , further comprising:

an adhesion layer between the buffer layer and the MLC.

19. The thin film integrated circuit of claim 18 , wherein the adhesion layer includes one or more layers of thin film TiOx.

20. The thin film integrated circuit of claim 18 , wherein the adhesion layer includes one or more layers of thin film Al 2 O 3 .

21. The thin film integrated circuit of claim 1 , wherein the thin film integrated circuit is attached to an integrated circuit chip to form a system-on-a-package (SoP) structure.