Patent Assignment
Reel/Frame 022343/0813
Assignment of Assignor's Interest
Recorded: 2009-03-05
Received: 2009-03-05
Pages: 6
Assignor
GENNUM CORPORATION
Executed: 2009-03-04
Assignee
PARATEK MICROWAVE, INC.
22 TECHNOLOGY WAY, MILLYARD TECHNOLOGY PARK, NASHUA, NH, 03060, UNITED STATES
Covered Properties
(19)
Electronic Component with Reactive Barrier and Hermetic Passivation Layer
Application:
12/325,683 →
Systems and Methods for a Thin Film Capacitor Having a Composite High-K Thin Film Stack
Application:
12/117,099 →
Local Oxidation of Silicon Planarization for Polysilicon Layers Under Thin Film Structures
Application:
11/776,116 →
Hermetic Passivation Layer Structure for Capacitors with Perovskite or Pyrochlore Phase Dielectrics
Application:
11/767,559 →
Thin Film Capacitor Having a Composite High-K Thin Film Stack
Application:
60/917,371 →
Multi-Level Thin Film Capacitor on a Ceramic Substrate and Method of Manufacturing the Same
Application:
11/734,798 →
Multi-Level Thin Film Capacitor on a Ceramic Substrate and Method of Manufacturing the Same
Application:
11/736,408 →
Electrostrictive devices
Application:
11/508,465 →
Hermetic passivation layer structure for capacitors with perovskite or pryochlore phase dielectrics
Application:
60/817,033 →
Low loss thin film capacitor and methods of manufacturing the same
Application:
11/396,447 →
Electrostrictive devices
Application:
60/711,933 →
Systems and methods for improving the loss of thin film capacitors
Application:
60/670,805 →
Multi-Level Thin Film Capacitor on a Ceramic Substrate and Method of Manufacturing the Same
Application:
10/997,344 →
Integrated Passive Components and Package with Posts
Application:
10/783,676 →
Integrated Passive Components and Package with Posts
Application:
10/783,673 →
Method of manufacture of multi-level thin film capacitor device on ceramic substrate with build in high density interconnect and method of manufacturing the same
Application:
60/525,897 →
Multipurpose Thin and Lightweight Stab and Ballistic Resistant Body Armor and Method
Application:
10/205,994 →
Integrated Passive Components and Package with Posts
Application:
10/071,581 →
Multiple Terminal Capacitor Structure
Application:
09/838,412 →