Patent Application
Provisional
App. No. 60/525,897
· Confirmation No. 1706
Method of manufacture of multi-level thin film capacitor device on ceramic substrate with build in high density interconnect and method of manufacturing the same
Provisional Application Expired
Inventors
Ivoyl P. Koutsaroff
Hamilton, CANADA
Mark Vandermeulen
Burlington, CANADA
Attorneys & Agents of Record
Prosecution
- Docket No.
- 764164605091
- Confirmation No.
- 1706
Child
Claims priority from a provisional application
→
App. 11/736,408
· US 8,569,142
Filed 2007-04-17
· Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362
Child
Claims priority from a provisional application
→
App. 14/035,195
· US 8,883,606
Filed 2013-09-24
· Patented Case
Child
Claims priority from a provisional application
→
App. 14/506,976
· US 9,305,709
Filed 2014-10-06
· Patented Case
Child
Claims priority from a provisional application
→
App. 10/997,344
· US 7,224,040
Filed 2004-11-24
· Patented Case
Child
Claims priority from a provisional application
→
App. 11/734,798
· US 7,875,956
Filed 2007-04-17
· Patented Case
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2013-07-30
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2013-07-30
from
GENNUM CORPORATION
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2009-03-05
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2004-04-07
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Quick Facts
- App. No.
- 60/525,897
- Filed
- 2003-11-28
External Links