Patent Assignment
Reel/Frame 015184/0149
Assignment of Assignor's Interest
Recorded: 2004-04-07
Pages: 3
Assignee
GENNUM CORPORATION
970 FRASER DRIVE, BURLINGTON, ONTARIO, L7L 5P5, CANADA
Covered Property
(1)
Method of manufacture of multi-level thin film capacitor device on ceramic substrate with build in high density interconnect and method of manufacturing the same
Application:
60/525,897 →
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 5, 2009
From: GENNUM CORPORATION
To: PARATEK MICROWAVE, INC.
Reel/Frame 022343/0813 →
Change of Name
Jul 31, 2012
From: PARATEK MICROWAVE, INC.
To: RESEARCH IN MOTION RF, INC.
Reel/Frame 028686/0432 →
Assignment of Assignor's Interest
Jul 30, 2013
From: RESEARCH IN MOTION RF, INC.
To: RESEARCH IN MOTION CORPORATION
Reel/Frame 030909/0908 →
Assignment of Assignor's Interest
Jul 30, 2013
From: RESEARCH IN MOTION CORPORATION
To: BLACKBERRY LIMITED
Reel/Frame 030909/0933 →
Assignment of Assignor's Interest
Mar 5, 2020
From: BLACKBERRY LIMITED
To: NXP USA, INC.
Reel/Frame 052095/0443 →