Die attach methods and apparatus for micro-fluid ejection device
View Patent ↗A micro-fluid ejection device structure, a multi-fluid cartridge containing the ejection device structure, and methods for making the ejection device structure and cartridge. The micro-fluid ejection device structure includes a fluid supply body containing at least three fluid supply slots therein. An ejection head substrate having fluid feed slots therein is attached to the fluid supply body. Each of the fluid supply slots in the body is in flow communication with at least one of the fluid feed slots in the substrate. A plurality of adhesive bond lines adhesively attach the ejection head substrate and the fluid supply body to one another. Each of the adhesive bond lines have a width of less than about 600 microns and are located between adjacent ones of the fluid supply slots in the body.
1. A micro-fluid ejection device structure, comprising:
a fluid supply body containing at least three fluid supply slots therein;
an ejection head substrate having fluid feed slots therein attached to the fluid supply body, each of the fluid supply slots in the body being in flow communication with at least one of the fluid feed slots in the substrate, wherein the substrate has a fluid feed slot density ranging from about 1.2 to about 3.0 fluid feed slots per millimeter; and
a plurality of adhesive bond lines adhesively attaching the ejection head substrate and the fluid supply body to one another, each of the adhesive bond lines having a width of less than about 600 microns and being located between adjacent ones of the fluid supply slots in the body.
2. The micro-fluid ejection device structure of claim 1 , wherein the adhesive comprises a laser ablated preformed adhesive layer.
3. The micro-fluid ejection device structure of claim 2 , wherein the adhesive is a B-staged ultraviolet (UV), microwave, or thermally curable adhesive.
4. The micro-fluid ejection device structure of claim 1 , wherein the bond line width between adjacent fluid supply slots ranges from about 100 to about 400 microns.
5. The micro-fluid ejection device structure of claim 1 , wherein the adhesive comprises an infra red absorptive die bond adhesive.
6. The micro-fluid ejection device structure of claim 1 , wherein the fluid feed slots and the fluid supply slots have a width ranging from about 50 microns to about 2000 microns.