Patent Assignment
Reel/Frame 070723/0907
Assignment of Assignor's Interest
Recorded: 2025-04-03
Pages: 33
Assignor
FUNAI ELECTRIC CO., LTD.
Executed: 2025-03-28
Assignee
BRADY WORLDWIDE, INC.
6555 WEST GOOD HOPE ROAD, MILWAUKEE, WISCONSIN, 53223
Covered Properties
(30)
Ink Jet Heater Chip with Internally Generated Clock Signal
Polyimide Thickfilm Flow Feature Photoresist and Method of Applying Same
Micro-Fluid Ejection Devices
Method of operating a microelectromechanical inkjet ejector to achieve a predetermined mechanical deflection
Methods of Fabricating Nozzle Plates
Method of Edge-to-Edge Imaging with an Imaging Apparatus
Process for Making a Micro-Fluid Ejection Head Structure
Air Funneling Inkjet Printhead
Die Attach Methods and Apparatus for Micro-Fluid Ejection Device
Micro-Fluid Ejection Head Containing Reentrant Fluid Feed Slots
Inkjet Printhead with Bubble Handling Properties
Ink Jet Printhead Garage Configured to Perform Maintenance Functions
Bridging Wick and Method for an Inkjet Printhead
Wick for an Inkjet Printhead
A Method of Making a Micro Fluid Ejection Head Structure
Multiple Layer Etch Stop and Etching Method
Inkjet Ink Composition
Inkjet Ink Composition
Power Sensing Circuit
Media Support for an Imaging Apparatus
Dry Etching Methods
Method for Controlling a Printhead
Methods and Apparatuses for Control of a Signal in a Printing Apparatus
Ink Tank for a Printhead
Image Forming Apparatus and Electronic Apparatus
Ink Jetting Assembly
Ink Jet Print Head Adapted to Minimize Orientation-Induced Line-Width Variation
Ink Jet Print Head Adapted to Minimize Orientation-Induced Line-Width Variation
Bridging Wick and Method for an Inkjet Printhead
Method of Removing Residue from a Substrate After a Drie Process
Patent:
7,531,047 →
Application:
11/954,929 →
Related Assignments
(1)
Other recorded transfers of the patents in this record — the chain of ownership.