IP Library Patent Application 11003429
Patent Application
App. No. 11/003,429

Wearable biomonitor with flexible thinned integrated circuit

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Quick Facts
Patent No.
US None
App. No.
11/003,429
Abstract

A sensor system ( 30 ) has a sensor module ( 10 ) and a receiver module ( 45 ). The sensor module ( 10 ) functions as a wireless data collection device and has a flexible thin sheet of silicon ( 60, 65, 70 ) comprising circuitry ( 71, 72, 73 ), a flexible power source ( 105 ), and a flexible support substrate ( 55 ). The silicon, power source, and flexible support substrate are integrated as layers of the sensor module ( 10 ). The layers are placed together in the form of an adhesive bandage ( 10 ). A plurality of electrodes ( 80 ) are connected to the sensor module ( 10 ) and protrude from the flexible substrate ( 55 ) for contacting the skin of a subject body ( 20 ). The receiver module ( 45 ) includes one of an RF receiver with a wireless port for continuously receiving data ( 40 ), or a physical I/O port ( 87 ) to which the sensor module ( 10 ) can be physically connected for downloading stored data from the sensor module ( 10 ).

Claims (38)

1 - 25 . (canceled)

26 . A method of monitoring a physiological characteristic, comprising:

positioning a flexible sensor module on the skin of a subject body to be monitored;

collecting data through the skin for a predetermined period of time; and

analyzing the data on a device that is physically separate from the sensor module;

wherein the sensor module comprises a flexible thin sheet of silicon comprising circuitry for collecting physiological data, a flexible power source and a flexible substrate.

27 . The method of monitoring of claim 26 , wherein the step of positioning comprises adhering the sensor module to the skin by adhesive pads on the sensor module.

28 . The method of monitoring of claim 27 , further comprising the step of discarding the sensor module after use on a single said subject body.

29 . The method of monitoring of claim 27 , further comprising the subsequent steps of:

removing the adhesive pads from the sensor module; and

heating the sensor module in an autoclave for sterilization.

30 . The method of monitoring of claim 26 , wherein:

the step of positioning further comprises locating the sensor module in any of a variety of positions on the skin; and

the step of collecting further comprises comfortably leaving the sensor module on the skin during normal activities of the subject body.

31 . The method of monitoring of claim 26 , wherein the steps of collecting and analyzing further comprise monitoring by EMG.

32 . The method of monitoring of claim 26 , wherein the steps of collecting and analyzing further comprise monitoring by at least one of EKG, EMG, EEG, blood sugar, blood pulse, or blood pressure.

33 . The method of monitoring of claim 32 , wherein:

the sensor module is one of a plurality of sensor modules, and further comprising:

positioning the plurality of sensor modules on selected positions on the skin; and

simultaneously collecting data by each of the sensor modules.

34 . A method of making a flexible sensor module, comprising:

grinding an inactive side of a silicon layer on which an IC resides until the silicon becomes thin and flexible;

mounting the silicon layer on a flexible substrate of polyimide by an anisotropic conductive epoxy intermediate layer; and

covering the silicon layer and the flexible substrate with a thin flexible battery.

35 . The method of making of claim 34 , wherein the step of grinding further comprises thinning the silicon layer to a thickness in the range from 10 to 50 microns.

36 . The method of making of claim 34 , further comprising:

metalizing the flexible substrate in order to:

provide an antenna; and

connect the IC to electrodes.

37 . A method of making a sensor system, comprising:

forming a sensor module by:

grinding an inactive side of a silicon layer on which an IC resides until the silicon becomes thin and flexible;

mounting the silicon layer on a flexible substrate;

covering the silicon layer and the flexible substrate with a thin flexible battery; and

providing a receiver module in the form of a data processing device for analyzing the data.

38 . (canceled)

39 . (canceled)

40 . (canceled)

Assignments (3)
CORRECTION TO THE SECURITY INTEREST RELEASE EXECUTION DATE AND TYPOGRAPHICAL ERROR WHICH DESCRIBED THIS RELEASE AS A SECURITY AGREEMENT RATHER THAN AS A RELEASE OF SECURITY AGREEMENT AT REEL/FRAME 021861/0531 AND RECORDED ON 11/19/2008. Recorded Jan 21, 2009
From: SQUARE 1 BANK
To: IRVINE SENSORS CORPORATION
Reel/Frame 022137/0609 →
SECURITY INTEREST Recorded Nov 19, 2008
From: SQUARE 1 BANK
To: IRVINE SENSORS CORPORATION
Reel/Frame 021861/0531 →
SECURITY INTEREST Recorded Apr 4, 2006
From: IRVINE SENSORS CORPORATION
To: SQUARE 1 BANK
Reel/Frame 017435/0142 →