Patent Assignment
Reel/Frame 022137/0609
Correction to the Security Interest Release Execution Date and Typographical Error Which Described This Release as a Security Agreement Rather Than as a Release of Security Agreement at Reel/Frame 021861/0531 and Recorded on 11/19/2008.
Recorded: 2009-01-21
Received: 2009-01-21
Pages: 10
Assignor
SQUARE 1 BANK
Executed: 2006-12-29
Assignee
IRVINE SENSORS CORPORATION
3001 REDHILL AVE., BUILDING 4, SUITE 108, COSTA MESA, CA, USA 92626, UNITED STATES
Covered Properties
(21)
Wearable biomonitor with flexible thinned integrated circuit
Application:
11/003,429 →
Three-dimensional imaging device incorporating stacked layers containing microelectronic circuits
Application:
10/805,849 →
Neo-Wafer Device and Method
Application:
10/703,177 →
Stacked microelectronic module with vertical interconnect vias
Application:
10/663,371 →
Cryopump Piston Position Tracking
Application:
10/615,641 →
Stackable Layers Containing Ball Grid Array Packages
Application:
10/360,244 →
Field Programmable Gate Array with a Variably Wide Word Width Memory
Application:
10/347,038 →
Method for Effectively Embedding Various Integrated Circuits Within Field Programmable Gate Arrays
Application:
10/346,363 →
Stackable Layers Containing Encapsulated Integrated Circuit Chips with One or More Overlying Interconnect Layers and a Method of Making the Same
Application:
10/302,680 →
Method and Apparatus for Temperature Compensation of an Uncooled Focal Plane Array
Application:
10/281,393 →
Wearable biomonitor with flexible thinned integrated circuit
Application:
10/197,006 →
Systems and Methods for Providing Loan Management from Cash or Deferred Income Arrangements
Application:
10/183,661 →
Stackable Microcircuit Layer Formed from a Plastic Encapsulated Microcircuit and Method of Making the Same
Application:
10/142,557 →
Method and Apparatus for Connecting Vertically Stacked Integrated Circuit Chips
Application:
10/128,728 →
Method of Making Stackable Layers Containing Encapsulated Integrated Circuit Chips with One or More Overlaying Interconnect Layers
Application:
09/938,686 →
High Speed Multi-Stage Switching Network Formed from Stacked Switching Layers
Application:
09/973,857 →
Stacking of Multilayer Modules
Application:
09/949,512 →
Stack of Multilayer Modules with Heat-Focussing Metal Layer
Application:
09/949,024 →
Multilayer Modules with Flexible Substrates
Application:
09/948,950 →
Retro-Reflector Warm Stop for Uncooled Thermal Imaging Cameras and Method of Using the Same
Application:
09/921,525 →
Method and Apparatus for Temperature Compensation of an Uncooled Focal Plane Array
Application:
09/853,819 →