Airflow control system
A method according to one embodiment may include providing a baffle assembly comprising at least one airflow control zone with an airflow resistance. The method of this embodiment may also include positioning said baffle assembly in a flow of air through a chassis. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.
1. An airflow control system comprising:
a chassis comprising an air inlet and an air exhaust;
a circuit board disposed within said chassis, said circuit board comprising a plurality of card slots configured for electrically coupling a plurality of cards to said circuit board; and
a dummy card configured to be coupled to one of said card slots of said circuit board, said dummy card comprising a baffle assembly, said dummy card is configured to be coupled to said chassis, and said baffle assembly is disposed between said air inlet and said air exhaust and comprises a plurality of airflow zones, each zone comprising a plurality of baffles, each of said plurality of baffles within each zone configured to have a different airflow resistance and configurable to provide a different airflow across components corresponding to each zone, the plurality of baffles configured to be selectively deployed, independent of one another, so as to achieve a desired airflow resistance between said air inlet and said air exhaust in said chassis.
2. The system according to claim 1 , wherein at least one baffle comprises at least one opening therethrough, and wherein air passes through said at least one opening at a predetermined rate when said at least one baffle is deployed.
3. The system according to claim 1 , wherein a first baffle of said plurality of baffles is configured to provide a first airflow resistance, and wherein a second baffle of said plurality of baffles is configured to provide a second airflow resistance.
4. The system according to claim 3 , wherein said first airflow resistance and said second airflow resistance are different.
5. The system according to claim 1 , wherein said plurality of baffles are configured to be selectively deployed between a stowed configuration and a deployed configuration, and wherein each baffle of said plurality of baffles is configured to be secured in the deployed configuration.
6. A dummy card, comprising:
a card body comprising a plurality of airflow zones, each zone comprising a plurality of baffles, each of said plurality of baffles within each zone configured to have different airflow resistance and configurable to provide a different airflow across components corresponding to each zone, the plurality of baffles configured to be selectively deployed, independent of one another, so as to achieve a desired airflow resistance within the airflow zone;
said card body is configured to couple to one of a plurality of card slots of a circuit board, wherein said plurality of card slots are configured to electrically couple the circuit board to a plurality of cards.
7. The dummy card according to claim 6 , wherein said card body comprises the form factor of a mezzanine card.
8. The dummy card according to claim 6 , wherein said circuit board comprises an Advanced Telecommunications Computing Architecture (ATCA) board.
9. The dummy card according to claim 6 , wherein each baffle of said plurality of baffles is configured to be deployed between a stowed configuration and a deployed configuration, and wherein each baffle of said plurality of baffles is configured to be secured in said deployed configuration.
10. The dummy card according to claim 9 , wherein at least one of said plurality of baffles provides an airflow resistance that is different from at least one other of said plurality of baffles.
11. The dummy card according to claim 6 , wherein at least one of said plurality of airflow zones provides an airflow resistances that is different from at least one other airflow zone.