Placement of absorbing material in a semiconductor device
View Patent ↗A semiconductor device includes a hermetically sealed housing having a top member and a bottom member. The bottom member includes a recess. A semiconductor die is enclosed within the housing. Absorbing material is positioned in the recess under the semiconductor die. A porous film is positioned between the semiconductor die and the absorbing material.
1. A semiconductor device comprising:
a hermetically sealed housing having a top member and a bottom member, said bottom member including a recess;
a semiconductor die enclosed within said housing;
absorbing material positioned in said recess under said semiconductor die; and
a porous film positioned between said semiconductor die and said absorbing material.
2. The semiconductor device as recited in claim 1 , wherein said absorbing material is attached to said housing within said recess.
3. The semiconductor device as recited in claim 1 , wherein said absorbing material is attached to a bottom surface of said semiconductor die and positioned in said recess when said die is secured in said housing.
4. The semiconductor device as recited in claim 1 , further including a cap positioned in said recess over said absorbing material.
5. A semiconductor device comprising:
a hermetically sealed housing having a top member and a bottom member, said bottom member including a recess;
a semiconductor die enclosed within said housing; means to absorb contaminants and vapor that have been sealed in said housing, said means to absorb positioned in said recess under said semiconductor die; and
a porous film positioned between said semiconductor die and said absorbing means.
6. The semiconductor device as recited in claim 5 , wherein said absorbing means is attached to said housing within said recess.
7. The semiconductor device as recited in claim 5 , wherein said absorbing means is attached to a bottom surface of said semiconductor die and positioned in said recess when said die is secured in said housing.
8. The semiconductor device as recited in claim 5 , further including a cap positioned at said recess over said absorbing means.
9. A semiconductor device comprising:
a hermetically sealed housing having a top member and a bottom member, said bottom member including a port;
a semiconductor die enclosed within said housing;
a casing bonded to said bottom member, said casing having an aperture positioned at said port;
absorbing material enclosed in said casing and positioned under said semiconductor die; and
a porous film positioned between said semiconductor die and said absorbing material.
10. The semiconductor device as recited in claim 9 , wherein said casing material is kovar.
11. A semiconductor device comprising:
a hermetically sealed housing having a top member and a bottom member;
a plurality of mounting pads disposed on a surface of said bottom member;
a semiconductor die enclosed within said housing and bonded to said plurality of mounting pads;
absorbing material positioned within a space defined by said mounting pads, said semiconductor die, and said bottom member surface; and
a porous film positioned between said semiconductor die and said absorbing material.
12. The semiconductor device as recited in claim 11 , wherein said absorbing material is attached to said bottom member surface.
13. The semiconductor device as recited in claim 11 , wherein said absorbing material is attached to a bottom of said semiconductor die.