IP Library Granted Patent US 7,119,375
Granted Patent B2
US 7,119,375 · App. 11/012,331 · Granted Oct 10, 2006

Light emitting diode and method for manufacturing the same

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Quick Facts
Patent No.
US 7,119,375
App. No.
11/012,331
Granted
Oct 10, 2006
Kind
B2
Abstract

A light emitting diode (LED) includes a substrate, a first conductive clad layer formed on the substrate, an active layer formed on the first conductive clad layer, a second conductive clad layer formed on the active layer, an alumina (Al 2 O 3 ) layer formed on the lower surface of the substrate, and an aluminum layer formed on the lower surface of the alumina (Al 2 O 3 ) layer. The substrate may be removed, and the aluminum layer and the alumina layer are formed directly on the lower surface of the first conductive clad layer.

Claims (32)

1. A light emitting diode, comprising:

a sapphire substrate;

a first conductive clad layer formed on the substrate;

an active layer formed on the first conductive clad layer;

a second conductive clad layer formed on the active layer;

an alumina (Al 2 O 3 )layer formed on the lower surface of the substrate;

an aluminum layer formed on the lower surface of the alumina (Al 2 O 3 ) layer;

a glass layer formed on the lower surface of the aluminum layer; and

another alumina (Al 2 O 3 ) layer formed between the aluminum layer and the glass layer.

2. The light emitting diode as set forth in claim 1 , wherein the first and second conductive clad layers are made of a semiconductor material of a GaN compound.

3. A light emitting diode, comprising:

a sapphire substrate;

a first conductive clad layer formed on the substrate;

an active layer formed on the first conductive clad layer;

a second conductive clad layer formed on the active layer;

an alumina (Al 2 O 3 ) layer formed on the lower surface of the substrate;

an aluminum layer formed on the lower surface of the alumina (Al 2 O 3 ) layer;

a high reflectivity structure that is formed on the lower surface of the substrate and includes two layers with different reflectivities, thereby exhibitina a blab reflectivity, wherein the two layers of the high reflector structure include said alumina (Al 2 O 3 ) layer formed on the lower surface of the substrate and said aluminum layer formed on the lower surface of the alumina (Al 2 O 3 ) layer;

a glass layer formed on the lower surface of the aluminum layer; and

another alumina (Al 2 O 3 ) layer formed between the aluminum layer and the glass layer.

4. The light emitting diode as set forth in claim 3 , wherein the first and second conductive clad layers are made of a semiconductor material of a GaN compound.

5. A light emitting diode, comprising:

first and second reflective layers having different reflectivities, said second reflective layer being positioned on top of the first reflective layer and defining together with said first reflective layer a reflective structure;

a sapphire substrate positioned on to of the second reflective layer;

a first conductive clad layer positioned on top of the substrate;

an active layer positioned on top of the first conductive clad layer;

a second conductive clad layer positioned on top of the active layer; and

a glass layer;

wherein

the first reflective layer is an aluminum layer and the second reflective layer is an alumina (Al 2 O 3 ) layer positioned on top of the aluminum layer to define said reflective structure; and

said aluminum layer is positioned on top of said glass layer;

said light emitting diode further comprising another alumina (Al 2 O 3 ) layer positioned between the aluminum layer and the glass layer.

Assignments (2)
MERGER Recorded Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 22, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024723/0532 →