IP Library › Patent Application 11014316
Patent Application
App. No. 11/014,316

Thermoplastic thermally-conductive interface articles

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Quick Facts
Patent No.
US None
App. No.
11/014,316
Abstract

A thermoplastic, thermally-conductive interface article is provided. The interface article is elastomeric and can be used to provide a thermally-conductive pathway between a heat-generating product such as an electronic device and a heat-sink. The interface article also can have good electrical-conductivity. The elastomeric interface article is made from a composition comprising a base thermoplastic elastomer matrix, thermally-conductive filler material, and temperature-activated phase change material.

Claims (5)

1 . An interface article suitable for use as an interface between a heat-generating device and a heat-dissipating device, comprising: a) about 20% to about 80% by weight of a thermoplastic elastomer matrix; b) about 20% to about 80% by weight of a thermally-conductive, filler material; and c) about 5 to about 50% by weight of a phase change material, said phase change material being capable of changing from a solid state to a liquid state and from a liquid state to a solid state within a temperature range of about 10° C. to about 115° C.

2 . The interface article of claim 1 , wherein the article is in the form of a film.

3 . The interface article of claim 1 , wherein the article is in the form of a pad.

4 . The interface article of claim 1 , wherein the article has a thermal conductivity of greater than 3 W/m° K.

5 . The interface article of claim 1 , wherein the article is electrically conductive and has a volume resistivity of 0.1 ohm-cm or lower and a surface resistivity of 1.0 ohm-cm or lower.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 9, 2008
From: MILLER, JAMES D.; MCCULLOUGH, KEVIN A.; SAGAL, E. MIKHAIL; PANEK, JEFF
To: COOL SHIELD, INC.
Reel/Frame 021654/0746 →