Bias voltage routing scheme for a digital micro-mirror device
An apparatus for use with a digital micro-mirror includes a hinge disposed outwardly from a substrate and capable of at least partially supporting a micro-mirror disposed outwardly from the hinge. The micro-mirror capable of being selectively transitioned between an on-state position and an off-state position based at least in part on a bias voltage received by a conductive conduit. The apparatus also includes a conductive layer disposed inwardly from the at least one micro-mirror. In one particular embodiment, the conductive layer enables a conductive path for the bias voltage substantially inwardly from a periphery of the micro-mirror.
1. An apparatus for use with a digital micro-mirror, comprising:
a hinge disposed outwardly from a substrate and capable of at least partially supporting a micro-mirror disposed outwardly from the hinge, the micro-mirror capable of being selectively transitioned between an on-state position and an off-state position based at least in part on a bias voltage received by a conductive layer;
a hinge void disposed inwardly from the hinge; and
a plurality of interconnected conductive conduits formed within the conductive layer and disposed inwardly from the micro-mirror, wherein the plurality of interconnected conductive conduits enable a conductive path for the bias voltage substantially inwardly from a periphery of the micro-mirror.
2. The apparatus of claim 1 , wherein the substrate comprises a CMOS substrate.
3. The apparatus of claim 1 , wherein the substrate comprises control circuitry capable of selectively transitioning the micro-mirror between an on-state position and an off-state position.
4. The apparatus of claim 1 , wherein the hinge void is substantially free from conductive materials.
5. The apparatus of claim 1 , wherein the hinge void comprises a width and a thickness over a desired length associated with at least some of the conductive layer disposed inwardly from the hinge.
6. The apparatus of claim 1 , wherein the conductive layer further comprises at least one channel interconnecting at least two of the plurality of conductive conduits.
7. A method of forming an apparatus for use with a digital micro-mirror, comprising:
forming a hinge disposed outwardly from a substrate, the hinge capable of at least partially supporting a micro-mirror disposed outwardly from the hinge; and
forming a hinge void within a conductive layer, the hinge void disposed inwardly from the hinge, wherein the hinge void is substantially free from conductive materials; and
routing a bias voltage substantially inwardly from a periphery of the micro-mirror.
8. The method of claim 7 , wherein the substrate comprises a material selected from the group consisting of silicon, poly-silicon, indium phosphide, germanium, and gallium arsenide.
9. The method of claim 7 , wherein forming the hinge void comprises removing substantially all of a width and a thickness over a desired length associated with at least some of the conductive layer disposed inwardly from the hinge.
10. The method of claim 7 , wherein the conductive layer comprises an aluminum alloy comprising an anti-reflective property.
11. The method of claim 7 , further comprising forming the conductive layer disposed outwardly from the substrate.
12. The method of claim 7 , further comprising enabling a conductive path around the periphery of the conductive layer.
13. The method of claim 12 , wherein enabling the conductive path around the periphery of the conductive layer comprises:
forming a plurality of interconnected conductive conduits within the conductive layer; and
wherein the combination of the plurality of interconnected conductive conduits form the conductive path for routing the bias voltage substantially inwardly from the periphery of the micro-mirror.
14. The method of claim 13 , wherein forming the interconnected conductive conduits comprises forming a plurality of channels, each of the plurality of channels interconnect at least two of the plurality of conductive conduits.
15. An apparatus for use with a digital micro-mirror, comprising:
a hinge disposed outwardly from a substrate and capable of at least partially supporting a micro-mirror disposed outwardly from the hinge, the micro-mirror capable of being selectively transitioned between an on-state position and an off-state position based at least in part on a bias voltage received by a conductive conduit; and
a conductive layer disposed inwardly from the at least one micro-mirror, wherein the conductive layer enables a conductive path for the bias voltage substantially inwardly from a periphery of the micro-mirror.
16. The apparatus of claim 15 , wherein the substrate comprises a CMOS substrate.
17. The apparatus of claim 15 , wherein the substrate comprises control circuitry capable of selectively transitioning the at least one micro-mirror between the on-state position and the off-state position.
18. The apparatus of claim 15 , wherein the conductive layer comprises a plurality of interconnected conductive conduits and at least one hinge void, the hinge void disposed inwardly from the hinge.
19. The apparatus of claim 18 , wherein the plurality of interconnected conductive conduits provide the conductive path for the bias voltage substantially inwardly from the periphery of the micro-mirror.
20. The apparatus of claim 18 , wherein the conductive layer further comprises at least one channel interconnecting at least two of the plurality of conductive conduits.