IP Library Granted Patent US 7,686,052
Granted Patent B2
US 7,686,052 · App. 11/020,667 · Granted Mar 30, 2010

Lamination apparatus and laser-induced thermal imaging method using the same

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Quick Facts
Patent No.
US 7,686,052
App. No.
11/020,667
Granted
Mar 30, 2010
Kind
B2
Abstract

A lamination apparatus and a laser-induced thermal imaging method using the same are provided. The lamination apparatus comprising: a chuck for fixing first and second substrates; and having at least one vacuum hole located therein and exposed outside of the first substrate therein.

Claims (15)

1. A lamination apparatus comprising:

a chuck for fixing first and second substrates; and having at least one vacuum hole located therein and exposed outside of the first substrate therein, the at least one vacuum hole adapted to make a space between the chuck and the second substrate into a vacuum state to thereby fix a planar surface of the second substrate to both a first surface of the chuck and a planar surface of the first substrate and fix the first substrate to a second surface of the chuck,

wherein the first surface and the second surface are on different planes and are connected by a first third surface and a second third surface, the second surface being a continuous planar surface the first third surface and the second third surface, and

wherein the first third surface and the second third surface are inclined with respect to the first surface and the second surface.

2. The lamination apparatus according to claim 1 , wherein the chuck further includes at least one second vacuum hole located under the first substrate.

3. The lamination apparatus according to claim 1 , wherein the chuck located in atmospheric-pressure inert-gas atmosphere.

4. The lamination apparatus according to claim 2 , wherein the vacuum hole makes a space between the chuck and the first substrate into a vacuum state to fix the first substrate.

5. The lamination apparatus according to claim 1 , further comprising at least one lift pin existing in the chuck.

6. The lamination apparatus according to claim 5 , wherein the lift pin functions to detach the first substrate from the chuck after a lamination process.

7. The lamination apparatus according to claim 1 , wherein a lamination process is performed on the second substrate by any one of a roller, a gas pressure, and a crown press.

8. The lamination apparatus according to claim 7 , wherein the lamination process is performed in an outward direction from a center.

9. The lamination apparatus according to claim 7 , wherein the lamination process is performed in one-way.

10. The lamination apparatus according to claim 1 , wherein the second substrate is larger than the first substrate.

11. The lamination apparatus according to claim 1 , wherein the second substrate is a framed substrate.

12. The lamination apparatus according to claim 1 , wherein the first substrate is a receptor substrate, and the second substrate is a donor substrate.

Assignments (2)
MERGER Recorded Aug 29, 2012
From: SAMSUNG MOBILE DISPLAY CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 028868/0387 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2008
From: SAMSUNG SDI CO., LTD.
To: SAMSUNG MOBILE DISPLAY CO., LTD.
Reel/Frame 022024/0026 →