IP Library Granted Patent US 7,544,446
Granted Patent B2
US 7,544,446 · App. 11/023,276 · Granted Jun 9, 2009

Masks of semiconductor devices and methods of forming patterns thereof

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Quick Facts
Patent No.
US 7,544,446
App. No.
11/023,276
Granted
Jun 9, 2009
Kind
B2
Abstract

Disclosed are a mask of a semiconductor device and a method for forming a pattern thereof, which is capable of correcting a line width bias between a long line width and a short line width when a mask of a semiconductor transistor is formed. The mask may include a plurality of rectangular light shielding patterns formed on a mask disc on which gate line and contact holes are formed; and a connection pattern composed of a plurality of division patterns for selectively connecting the plurality of rectangular light shielding patterns one another. The plurality of rectangular light shielding patterns overlap with the contact hole mask and are formed on both sides of the connection pattern. The connection pattern is divided into 3 to 7 division patterns.

Claims (23)

1. A mask used in fabricating a CMOS semiconductor device, comprising:

a plurality of rectangular light shielding patterns on a mask; and

a connection pattern comprising three or more rectangular division patterns between the plurality of rectangular light shielding patterns, wherein at least one of the rectangular division patterns has a greater vertical length than at least two other rectangular division patterns, and the vertical lengths of the rectangular division patterns correspond to a gate line width.

2. The mask of claim 1 , wherein the plurality of rectangular light shielding patterns overlap with a contact hole mask and are on both sides of the connection pattern.

3. The mask of claim 1 , wherein the connection pattern consists of 3 to 7 rectangular division patterns.

4. The mask of claim 1 , wherein at least one of the rectangular division patterns overlaps with the gate line.

5. A method for forming a mask pattern used in fabricating a CMOS semiconductor device, comprising:

forming a plurality of rectangular light shielding patterns on a mask;

forming a connection pattern comprising three or more rectangular division patterns for between the plurality of rectangular light shielding patterns, wherein at least one of the rectangular division patterns has a greater vertical length than at least two other rectangular division patterns, and the vertical lengths of the rectangular division patterns correspond to a gate line width;

forming a gate line in a region of the CMOS semiconductor device between regions corresponding to the plurality of rectangular light shielding patterns; and

forming contact holes in regions of the CMOS semiconductor device corresponding to the plurality of rectangular light shielding patterns.

6. The method of claim 5 , wherein the plurality of rectangular light shielding patterns overlap with a contact hole mask and are on both sides of the plurality of division pattern.

7. The method of claim 5 , wherein connection pattern consists of 3 to 7 division patterns.

8. The mask of claim 1 , wherein a width of the connection pattern is less than a width of a corresponding rectangular light shielding pattern.

9. The mask of claim 1 , wherein each of the plurality of rectangular light shielding patterns overlap with a contact hole.

10. The method of claim 5 , further comprising forming rectangular light shielding patterns on opposite sides of the connection pattern.

11. The mask of claim 3 , wherein at least one of the rectangular division patterns overlaps with the gate line.

12. The mask of claim 11 , wherein each of the rectangular division pattern overlaps with the gate line.

13. The mask of claim 4 , wherein each of the at least one rectangular division pattern overlaps with the gate line.

14. The mask of claim 1 , wherein a gate line is formed in a region of the CMOS semiconductor device between regions corresponding to the plurality of rectangular light shielding patterns.

15. The mask of claim 1 , wherein contact holes are formed in regions of the CMOS semiconductor device corresponding to the plurality of rectangular light shielding patterns.

16. The mask of claim 4 , wherein at least two rectangular division patterns do not overlap with the gate line.

17. The mask of claim 3 , wherein at least two rectangular division patterns do not overlap with the gate line.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR PREVIOUSLY RECORDED ON REEL 017749 FRAME 0335. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNOR SHOULD BE "DONGBUANAM SEMICONDUCTOR INC.". Recorded Jun 21, 2006
From: DONGBUANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017821/0670 →
CHANGE OF NAME Recorded Jun 8, 2006
From: DONGANAM SEMICONDUCTOR INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017749/0335 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 27, 2004
From: LEE, JUN SEOK
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016141/0764 →