Method for forming mask pattern of semiconductor device

1. A method for forming a mask pattern of a semiconductor device, comprising:

arranging a main pattern;

arranging at least three first fine auxiliary patterns in the vicinity of the main pattern, wherein the first fine auxiliary patterns have a line width of 0.03 to 0.12 μm and oblique sides of the first fine auxiliary patterns are perpendicular to an edge of the main pattern;

arranging at least three second fine auxiliary patterns in the vicinity of edges of the main pattern, the second fine auxiliary patterns having a predetermined tilt angle with respect to the first fine auxiliary patterns, oblique sides that are perpendicular to an edge of the main pattern and an oblique side that is substantially perpendicular to an edge of the first fine auxiliary patterns, and a line width of 0.03 to 0.12 μm, arranged such that the second fine auxiliary patterns are isolated from the first fine auxiliary patterns by a distance of more than 0.02 μm; and

a third fine auxiliary pattern having a tilt angle of about 45 degrees with respect to the first fine auxiliary patterns.

2. The method of claim 1 , wherein the first fine auxiliary patterns and the second fine auxiliary patterns and the main pattern do not contact one another.

3. The method of claim 1 , wherein the first fine auxiliary patterns and the second fine auxiliary patterns are arranged in the outside of the main pattern when the edge of the main pattern has an angle of 45 to 135 degrees, and the first fine auxiliary patterns and the second fine auxiliary patterns are arranged in the inside of the main pattern when the edge of the main pattern has an angle other than an angle of 45 to 135 degrees.