IP Library Granted Patent US 7,080,332
Granted Patent B2
US 7,080,332 · App. 11/024,630 · Granted Jul 18, 2006

SPICE simulation system for diode and method of simulation using the same

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Quick Facts
Patent No.
US 7,080,332
App. No.
11/024,630
Granted
Jul 18, 2006
Kind
B2
Abstract

A system and method for simulating a diode device measures electrical characteristics of a plurality of diodes; normalizes the measured electrical characteristics of the diode; extracts a plurality of device parameters of each of the diodes from the normalized characteristics; converts the device parameters of each of the diodes to values per unit area; obtains a linear equation from the converted device parameters; and predicts electrical characteristics of certain diode area from the linear equation and the device parameters. The linear equation is obtained by a least square method of the regression analysis to extract the device parameters of each of the diodes which are converted to value per unit area. The device parameters are obtained by a simultaneous equation which is derived from both a diode having larger area component and a diode having greater length component.

Claims (25)

1. A computer implemented method for simulating a diode device comprising the steps of:

measuring electrical characteristics of a plurality of diode devices;

normalizing the electrical characteristics measured in said measuring step; extracting a plurality of device parameters for each of the plurality of diode devices from the normalized electrical characteristics;

converting the plurality of device parameters for each of the diode devices to values per unit area (AREA);

obtaining a linear equation from the converted device parameters; and

predicting electrical characteristics for a diode area from the linear equation and the device parameters.

2. The method of claim 1 , wherein the step of obtaining the linear equation includes performing a least square method of regression analysis.

3. The method of claim 1 , wherein the step of extracting the device parameters includes extracting reverse saturation current (I S ), Knee current (I K ), emission coefficient (N), and sheet resistance (R S ).

4. The method of claim 1 , wherein the electrical characteristics include current value according to voltage variation.

5. The method of claim 1 , wherein the obtaining step includes obtaining a linear equation of

Sheet Resistance: ( R S )=(10 RS1 *AREA RS2 )*AREA

Knee Current: ( I K )=(10 IK1 *AREA IK2 )/AREA

Emission Coefficient: ( N )= N 1 −[N 2 *log 10(AREA)].

6. A computer implemented simulating system for a diode device including:

a measuring module configured to measure an electrical current according to voltage variation;

a current calculating module configured to calculate a normalized current value from the measured current;

a device parameter extracting module configured to extract device parameters of each of the diodes by using the calculated current value;

a linear equation module configured to obtain a linear equation of the device parameters; and

a prediction module configured to obtain the electrical characteristics of each of the diodes from the linear equation obtained in the linear equation module and the device parameters.

7. The system of claim 6 , wherein the linear equation module is configured to extract the device parameters for each diode convert to values per unit area by using a least square method of regression analysis.

8. The system of claim 6 , wherein the linear equation is

Sheet Resistance: ( R S )=(10 RS1 *AREA RS2 )*AREA

Knee Current: ( I K )=(10 IK1 *AREA IK2 )/AREA

Emission Coefficient: ( N )= N 1 −[N 2 *log 10(AREA)].

9. The system of claim 6 , wherein the device parameters include reverse saturation current (I S ), Knee current (I K ), emission coefficient (N), and sheet resistance (R S ).

Assignments (2)
CHANGE OF NAME Recorded May 23, 2006
From: DONGBU-ANAM SEMICONDUCTOR, INC.
To: DONGBU ELECTRONICS CO., LTD.
Reel/Frame 017663/0468 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 30, 2004
From: KWAK, SANG HUN
To: DONGBUANAM SEMICONDUCTOR, INC.
Reel/Frame 016136/0771 →