Voltage supply circuit of semiconductor device
The purpose of the present invention is to decrease a leak current of a voltage supply circuit using a MOS transistor. This voltage supply circuit comprises an n-channel MOS transistor having a low threshold voltage, the drain of which is connected to the power supply voltage, and a p-channel MOS transistor, the source of which is connected to the source of the n-channel MOS transistor and which supplies a voltage vii from the drain to a load circuit. Since a voltage V gs=1 V is applied to the gate-sources of the p-channel MOS transistor when said circuit is on standby, the p-channel MOS transistor operates in a larger cut-off region than an ordinary cut-off region.
1. A semiconductor device, comprising:
a voltage supply circuit comprising:
an n-channel MOS transistor, the drain of which is connected to a power supply, the source of which is connected to a channel of the n-channel MOS transistor, wherein a voltage of the gate of the n-channel MOS transistor is controlled so that the n-channel MOS transistor is in an on-state during an operation and is in a cut-off condition in a standby; and
an p-channel MOS transistor, the source of which is connected to the source of the n-channel MOS transistor, and the drain of which is connected to a load, wherein
when being on standby, for an output voltage supplied from the drain of the p-channel MOS transistor to the load to be a grounding potential, a voltage equivalent to or higher than a power supply voltage is applied to the gate of the p-channel MOS transistor so that a gate-source voltage of the p-channel MOS transistor, higher than the gate-source voltage of the p-channel MOS transistor between the gate and source under a cut-off condition of the p-channel MOS transistor, is applied between the gate and source of the p-channel MOS transistor,
wherein when a voltage is applied to the load, a grounding potential is supplied to the gate of the p-channel MOS transistor so as to set the p-channel MOS transistor to be in the on-state and a voltage equivalent to or higher than the power supply voltage is supplied to the gate of the n-channel MOS transistor so as to set the n-channel MOS transistor to be in the on-state,
wherein, when being on standby, the voltage equivalent to or higher than the power supply voltage is applied to the gate of the p-channel MOS transistor and the grounding potential or a negative potential is applied to the gate of the n-channel MOS transistor and the gate-source voltage of the p-channel MOS transistor, higher than the voltage between the gate and source of the p-channel MOS transistor under the cut-off condition, is applied so that the absolute value of the difference in voltage between the gate-source voltage of the p-channel MOS transistor when said transistor is turned on and the gate-source voltage of the p-channel MOS transistor when said transistor is turned off is larger than the absolute value of the difference in voltage between the gate-source voltage when said p-channel MOS transistor is turned on and the gate-source voltage when said p-channel MOS transistor is turned off based on a cut-off condition.
2. The semiconductor device according to claim 1 , wherein
when being on standby for the output voltage supplied from the drain of the p-channel MOS transistor to the load to be the grounding potential, the voltage equivalent to or higher than the power supply voltage is applied to the gate of the p-channel MOS transistor and the gate-source voltage of the p-channel MOS transistor higher than the gate-source voltage of the p-channel MOS transistor between the gate and source under the cut-off condition is applied between the gate and source of the p-channel MOS transistor, and the grounding potential or a negative potential is applied to the gate of the n-channel MOS transistor and a voltage lower than the voltage between the gate and source under the cut-off condition of the n-channel MOS transistor is applied between the gate and source of the n-channel MOS transistor.
3. The semiconductor device according to claim 2 , wherein
when the potential of a connecting point of the n-channel MOS transistor and the p-channel MOS transistor is given as Vb, the power supply voltage is applied to the gate of the p-channel MOS transistor when said circuit is on standby so that the gate-source voltage of the p-channel MOS transistor is made to be a difference in voltage between the power supply voltage and the voltage potential Vb.
4. The semiconductor device according to claim 2 , wherein
when the potential of a connecting point of the n-channel MOS transistor and the p-channel MOS transistor is given as Vb, the grounding potential is applied to the gate of the n-channel MOS transistor when said voltage supply circuit is on standby so that the gate-source voltage of the n-channel MOS transistor is made to be a voltage which is lower by Vb than 0 V.
5. The semiconductor device according to claim 2 , wherein
a W/L ratio of the channel width W to the channel length L of the p-channel MOS transistor of the voltage supply circuit is set to such a value that compensates for a voltage drop due to the n-channel MOS transistor.
6. The semiconductor device according to claim 1 , wherein
when being on the standby, a voltage difference smaller than the voltage difference between the gate and source under the cut-off condition is applied between the gate-source of the p-channel MOS transistor so that
the absolute value of the difference in voltage between the gate-source voltage of the p-channel MOS transistor when said transistor is turned on and the gate-source voltage of the p-channel MOS transistor when said transistor is turned off is larger than the absolute value of the difference in voltage between the gate-source voltage when said p-channel MOS transistor is turned on and the gate-source voltage when said p-channel MOS transistor is turned off based on a cut-off condition.
7. The semiconductor device according to claim 1 , wherein
when being on the standby, a voltage difference smaller than the voltage difference between the gate and source under the cut-off condition is applied between the gate and source of the p-channel MOS transistor so that
the absolute value of the difference in voltage between the gate-source voltage of the n-channel MOS transistor when said transistor is turned on and the gate-source voltage of the p-channel MOS transistor when said transistor is turned off is larger than the absolute value of the difference in voltage between the gate-source voltage when said p-channel MOS transistor is turned on and the gate-source voltage when said p-channel MOS transistor is turned off based on a cut-off condition.
8. The semiconductor device according to claim 1 , wherein
when the potential of a connecting point of the n-channel MOS transistor and the p-channel MOS transistor is given as Vb, the power supply voltage is applied to the gate of the p-channel MOS transistor when said voltage supply circuit is on standby so that the gate-source voltage of the p-channel MOS transistor is made to be a difference in voltage between the power supply voltage and the voltage potential Vb.
9. The semiconductor device according to claim 1 , wherein
when the potential of a connecting point of the n-channel MOS transistor and the p-channel MOS transistor is given as Vb, the grounding potential is applied to a gate of the n-channel MOS transistor when said circuit is on standby so that the gate-source voltage of the n-channel MOS transistor is made to be a voltage which is lower by Vb than 0 V.
10. The semiconductor device according to claim 1 , wherein
a W/L ratio of the channel width W to the channel length L of the p-channel MOS transistor of the voltage supply circuit is set to such a value that compensates for a voltage drop due to the n-channel MOS transistor.