IP Library › Granted Patent US 7,151,502
Granted Patent B2
US 7,151,502 · App. 11/025,397 · Granted Dec 19, 2006

Phased antenna array module

Assignee: Tessera, Inc.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,151,502
App. No.
11/025,397
Granted
Dec 19, 2006
Kind
B2
Abstract

A phased antenna array is disclosed. The phased antenna array is composed of one or more modules and has a plurality of antenna. The array has a plurality of antenna configured to operate as an array and each module has at least one antenna. The modules have a substrate that supports the antenna, a microelectronic device for sending signals to or receiving signals from said antenna and conductive traces that connect that antenna to the microelectronic device. In those embodiments where the phased antenna array has more than one module, a common substrate supports the one or more modules. A combination of circuitry and interconnects achieves the desired electrical interconnection between the modules.

Claims (23)

1. A module comprising:

a substrate supporting interconnect circuitry;

a plurality of microelectronic devices in electrical communication with said interconnect circuitry; and

a plurality of antenna elements in electrical communication with at least one of said microelectronic devices in a manner that permits the devices to either transmit, receive or transmit and receive signals within an operating frequency range,

wherein the substrate, devices, and antenna combined weigh no more than about 10 grams.

2. The module of claim 1 , wherein the substrate, devices, and antenna combined weigh no more than about 5 grams.

3. The module of claim 2 , wherein the substrate, devices, and antenna combined weigh no more than about 2 grams.

4. The module of claim 1 , wherein the total weight of the module is less than about 10 grams.

5. The module of claim 4 , wherein the total weight of the module is less than about 5 grams.

6. The module of claim 5 , wherein the total weight of the module is less than about 2 grams.

7. The module of claim 1 , wherein the antenna elements are arranged in an array.

8. The module of claim 1 , further comprising a plastic encapsulant.

9. The module of claim 8 wherein the at least one microelectronic device is an integrated circuit chip packaged in the plastic encapsulant.

10. The module of claim 1 , wherein the substrate is flexible.

11. The module of claim 1 , wherein the substrate has a dielectric constant less than about 5.

12. The module of claim 1 , wherein the substrate is made of a polymeric material.

13. The module of claim 1 , wherein the substrate has a loss tangent that is less than about 0.001.

14. The module of claim 1 , wherein the operating frequency range is 1 GHz to 300 GHz.

15. The module of claim 1 , wherein the operating frequency range is 3 Hz to 1 GHz.

16. The module of claim 1 , wherein the module has a total volume that is less than about 15 cm 3 .

17. The module of claim 1 , wherein the substrate is associated with a substrate footprint, the devices are associated with a device footprint, and the substrate footprint does not exceed the device footprint by more than about 25%.

18. The module of claim 1 , wherein the module has an operating pressure range of about 0 to about 1 atmosphere.

19. The module of claim 1 , wherein the plurality of microelectronic devices further comprise active and passive microelectronic devices.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION; TESSERA ADVANCED TECHNOLOGIES, INC; DTS, INC.; DTS LLC; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
Reel/Frame 052920/0001 →
SECURITY INTEREST Recorded Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.; DIGITALOPTICS CORPORATION; DIGITALOPTICS CORPORATION MEMS; DTS, LLC; DTS, INC.; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 22, 2005
From: STAVROS, ANDY; TSAI, MING; WILSON, STUART E.
To: TESSERA, INC.
Reel/Frame 016384/0520 →
Continuity (1)
Related Publication 20060139210A1 · Jun 29, 2006