High-brightness gallium-nitride based light emitting diode structure
View Patent ↗A GaN-based LED structure is provided so that the brightness and luminous efficiency of the GaN-based LED are enhanced effectively. The greatest difference between the GaN-based LEDs according to the invention and the prior arts lies in the addition of a masking buffer layer on top of the p-type contact layer and a p-type roughened contact layer on top of the masking buffer layer. The masking buffer layer could be formed using MOCVD to deposit Si x N y (x,y≧1), Mg w N z (w,z≧1), or Al s In t Ga 1-s-t N (0≦s,t<1, s+t≦1) heavily doped with Si and/or Mg. The masking buffer layer is actually a mask containing multiple randomly distributed clusters. Then, on top of the masking buffer layer, a p-type roughened contact layer made of p-type Al u InGa 1-u-v N (0≦u,v< 1 , u+v≦ 1 ) is developed. The p-type roughened contact layer does not grow directly on top of the masking buffer layer. Instead, the p-type roughened contact layer starts from the top surface of the underlying p-type contact layer not covered by the masking buffer layer's clusters. The p-type roughened contact layer then grows upward until it passes (but does not cover) the mask of the masking buffer layer for a specific distance. The total internal reflection that could have been resulted from the GaN-based LEDs' higher index of refraction than that of the atmosphere could be avoided. The GaN-based LEDs according to the present invention therefore have superior external quantum efficiency and luminous efficiency.
1. A high-brightness GaN-based LED structure, comprising:
a substrate made of a material selected from the group consisting of sapphire, 6H—SiC, 4H—SiC, Si, ZnO, GaAs, MgAl 2 O 4 , and an oxide monocrystalline having a lattice constant compatible with those of nitride semiconductors;
a buffer layer made of Al a Ga b In 1-a-b N (0≦a,b<1, a+b≦1) having a specific composition located on top of an upper side of said substrate;
an n-type contact layer made of a GaN-based material located on top of said buffer layer;
an active layer made of InGaN located on top a part of said n-type contact layer;
a negative electrode located on top of another part of said n-type contact layer not overlapping with said active layer;
a p-type cladding layer made of a p-type GaN-based material located on top of said active layer;
a p-type contact layer made of p-type GaN located on top of said p-type cladding layer;
a masking buffer layer made of a two-element nitride having a thickness between 5 Å and 100 Å located on top of said p-type contact layer, said masking buffer layer comprising a plurality of randomly distributed clusters made of said two-element nitride;
a p-type roughened contact layer made of Al e In f Ga 1-e-f N, (0≦e,f<1, e+f≦1) having a specific composition, said p-type roughened contact layer growing upward from a top surface of said p-type contact layer not covered by said masking buffer layer's clusters until said p-type roughened contact layer passes without covering said masking buffer layer's mask and reaches a thickness between 500 Å and 10,000 Å;
a transparent conductive layer selected from the group consisting of a metallic conductive layer and a transparent oxide layer, located on top of a part of said p-type roughened contact layer's upper surface, said metallic conductive layer made of a material selected from the group consisting of Ni/Au alloy, Ni/Pt alloy, Ni/Pd alloy, Pd/Au alloy, Pt/Au alloy, Cr/Au alloy, Ni/Au/Be alloy, Ni/Cr/Au alloy, Ni/Pt/Au alloy, and Ni/Pd/Au alloy, and said transparent oxide layer made of a material selected from the group consisting of ITO, CTO, ZnO:Al, ZnGa 2 O 4 , SnO 2 :Sb, Ga 2 O 3 :Sn, AglnO 2 :Sn, In 2 O 3 :Zn, CuAlO 2 , LaCuOS, NiO, CuGaO 2 , and SrCu 2 O 2 ; and
a positive electrode located on top of another part of said p-type roughened contact layer's upper surface not covered by said transparent conductive layer, made of a material selected from the group consisting of Ni/Au alloy, Ni/Pt alloy, Ni/Pd alloy, Ni/Co alloy, Pd/Au alloy, Pt/Au alloy, Ti/Au alloy, Cr/Au alloy, Sn/Au alloy, Ta/Au alloy, TiN, TiWN x (x≧0), and WSi y (y≧0).
2. The high-brightness GaN-based LED structure as claimed in claim 1 , wherein said two-element nitride is Si c N d (c,d≧1) having a specific composition.
3. The high-brightness GaN-based LED structure as claimed in claim 1 , wherein said two-element nitride is Mg g N h (g,h≧1) having a specific composition.
4. A high-brightness GaN-based LED structure, comprising:
a substrate made of a material selected from the group consisting of sapphire, 6H—SiC, 4H—SiC, Si, ZnO, GaAs, MgAl 2 O 4 , and an oxide monocrystalline having a lattice constant compatible with those of nitride semiconductors;
a buffer layer made of Al a Ga b In 1-a-b N (0≦a,b<1, a+b≦1) having a specific composition located on top of an upper side of said substrate;
an n-type contact layer made of a GaN-based material located on top of said buffer layer;
an active layer made of InGaN located on top a part of said n-type contact layer;
a negative electrode located on top of another part of said n-type contact layer not overlapping with said active layer;
a p-type cladding layer made of a p-type GaN-based material located on top of said active layer;
a p-type contact layer made of p-type GaN located on top of said p-type cladding layer;
a masking buffer layer made of Al k In 1 Ga 1-k-1 N (0≦k,1<1, k+1≦1) having a specific composition and having a thickness between 5 Å and 100 Å located on top of said p-type contact layer, said masking buffer layer doped up to a concentration by a dopant selected from group II and group IV elements, said masking buffer layer comprising a plurality of randomly distributed clusters made of Al k In 1 Ga 1-k-1 N;
a p-type roughened contact layer made of Al e In f Ga 1-e-f N, (0≦e,f<1, e+f≦1) having a specific composition, said p-type roughened contact layer growing upward from a top surface of said p-type contact layer not covered by said masking buffer layer's clusters until said p-type roughened contact layer passes without covering said masking buffer layer's mask and reaches a thickness between 500 Å and 10,000 Å;
a transparent conductive layer selected from the group consisting of a metallic conductive layer and a transparent oxide layer, located on top of a part of said p-type roughened contact layer's upper surface, said metallic conductive layer made of a material selected from the group consisting of Ni/Au alloy, Ni/Pt alloy, Ni/Pd alloy, Pd/Au alloy, Pt/Au alloy, Cr/Au alloy, Ni/Au/Be alloy, Ni/Cr/Au alloy, Ni/Pt/Au alloy, and Ni/Pd/Au alloy, and said transparent oxide layer made of a material selected from the group consisting of ITO, CTO, ZnO:Al, ZnGa 2 O 4 , SnO 2 :Sb, Ga 2 O 3 :Sn, AgInO 2 :Sn, In 2 O 3 :Zn, CuAlO 2 , LaCuOS, NiO, CuGaO 2 , and SrCu 2 O 2 ; and
a positive electrode located on top of another part of said p-type roughened contact layer's upper surface not covered by said transparent conductive layer, made of a material selected from the group consisting of Ni/Au alloy, Ni/Pt alloy, Ni/Pd alloy, Ni/Co alloy, Pd/Au alloy, Pt/Au alloy, Ti/Au alloy, Cr/Au alloy, Sn/Au alloy, Ta/Au alloy, TiN, TIWN x (x≧0), and WSi y (y≧0).
5. The high-brightness GaN-based LED structure as claimed in claim 4 , wherein said dopant is Si.
6. The high-brightness GaN-based LED structure as claimed in claim 4 , wherein said dopant is Mg.
7. The high-brightness GaN-based LED structure as claimed in claim 4 , wherein said dopant is Si and Mg.
8. The high-brightness GaN-based LED structure as claimed in claim 4 , wherein said concentration is greater than 1×10 20 cm −3 .