Capacitor element
A capacitor element is provided which is composed of a lower electrode, an upper electrode formed in opposing relation to the lower electrode, and a capacitor dielectric film made of a ferroelectric material or a high dielectric material and formed between the lower and upper electrodes. The lower electrode, the capacitor dielectric film, and the upper electrode are formed in a region extending at least from within a hole provided in an interlayer insulating film having a first hydrogen barrier film disposed on the upper surface thereof toward a position above the hole. A second hydrogen barrier film in contact with the first hydrogen barrier film is disposed to cover the upper surface of the upper electrode and the side surface of the portion of the upper electrode which has been formed above the hole.
1. A capacitor element comprising:
an interlayer insulating film formed over a substrate;
a first hydrogen barrier film formed on the interlayer insulating film, wherein a hole is formed in the interlayer insulating film and the first hydrogen barrier film;
a capacitor element comprising a lower electrode, a capacitor dielectric film of a ferroelectric material or a high dielectric material and an upper electrode, each of which being formed in a region extending from within the hole toward a position above the first hydrogen barrier film; and
a second hydrogen barrier film formed over the capacitor element and the first hydrogen barrier film, wherein the second hydrogen barrier film is in contact with the first hydrogen barrier film in a periphery of the capacitor element, while covering the entire top surface of the capacitor element;
wherein the first hydrogen barrier film is formed of an insulating material different from that of the interlayer insulating film; and
wherein an edge portion of the capacitor dielectric film is in contact with the first hydrogen barrier film.
2. The capacitor element of claim 1 , wherein a third hydrogen barrier film in contact with the first hydrogen barrier film is disposed on a sidewall of the hole.
3. The capacitor element of claim 2 , wherein
a fifth hydrogen barrier film having an upper surface of a size not smaller than a bottom portion of the hole is disposed under the hole and
the fifth hydrogen barrier film and the third hydrogen barrier film are in contact with each other.
4. The capacitor element of claim 3 , wherein
a lower-layer insulating film provided with a buried plug made of a conductive material is formed under the interlayer insulating film and
the buried plug has an upper end thereof in contact with a lower surface of the fifth hydrogen barrier film.
5. The capacitor element of claim 4 , wherein
a sixth hydrogen barrier film formed to surround the buried plug is disposed in an uppermost layer of the lower-layer insulating film and
the sixth hydrogen barrier film is in contact with the fifth hydrogen barrier film.
6. The capacitor element of claim 5 , wherein
a seventh hydrogen barrier film is disposed in an uppermost layer of the buried plug and
the seventh hydrogen barrier film is in contact with the fifth hydrogen barrier film.
7. The capacitor element of claim 4 , wherein
a seventh hydrogen barrier film is disposed in an uppermost layer of the buried plug and
the seventh hydrogen barrier film is in contact with the fifth hydrogen barrier film.
8. The capacitor element of claim 2 , wherein
a lower-layer insulating film provided with a buried plug made of a conductive material is formed under the interlayer insulating film and
the buried plug has an upper end thereof in contact with a bottom portion of the hole.
9. The capacitor element of claim 8 , wherein
a sixth hydrogen barrier film formed to surround the buried plug is disposed in an uppermost layer of the lower-layer insulating film and
the sixth hydrogen barrier film is in contact with the bottom portion of the hole.
10. The capacitor element of claim 9 , wherein
a seventh hydrogen barrier film is disposed in an uppermost layer of the buried plug and
the seventh hydrogen barrier film is in contact with the bottom portion of the hole.
11. The capacitor element of claim 8 , wherein
a seventh hydrogen barrier film is disposed in an uppermost layer of the buried plug and
the seventh hydrogen barrier film is in contact with the bottom portion of the hole.
12. The capacitor element of claim 1 , wherein
a third hydrogen barrier film in contact with the first hydrogen barrier film is disposed on a sidewall of the hole, and
a fourth hydrogen barrier film in contact with the third hydrogen barrier film is disposed on a bottom portion of the hole.
13. The capacitor element of claim 12 , wherein a fifth hydrogen barrier film in contact with at least the fourth hydrogen barrier film is disposed under the hole.
14. A capacitor element comprising:
an interlayer insulating film formed over a substrate;
a first hydrogen barrier film of SiN formed on the interlayer insulating film, wherein a hole is formed in the interlayer insulating film and the first hydrogen barrier film;
a capacitor element comprising a lower electrode, a capacitor dielectric film of a ferroelectric material or a high dielectric material and an upper electrode, each of which being formed in a region extending from within the hole toward a position above the first hydrogen barrier film; and
a second hydrogen barrier film formed over the capacitor element and the first hydrogen barrier film, wherein the second hydrogen barrier film is in contact with the first hydrogen barrier film;
wherein the interlaYer insulating film is formed of a material different from that of the first hydrogen barrier film; and
wherein an edge portion of the capacitor dielectric film is in contact with the first hydrogen barrier film.
15. The capacitor element of claim 14 , wherein a third hydrogen barrier film in contact with the first hydrogen barrier film is disposed on a sidewall of the hole.
16. The capacitor element of claim 15 , wherein
a lower-layer insulating film provided with a buried plug made of a conductive material is formed under the interlayer insulating film and
the buried plug has an upper end thereof in contact with a bottom portion of the hole.
17. The capacitor element of claim 14 , wherein
a third hydrogen barrier film in contact with the first hydrogen barrier film is disposed on a sidewall of the hole, and
a fourth hydrogen barrier film in contact with the third hydrogen barrier film is disposed on a bottom portion of the hole.