Filter assembly, method of manufacturing the same, and plasma display panel using the same
View Patent ↗A filter assembly, a plasma display panel with the filter assembly and a method of manufacturing the filter assembly. The plasma display panel includes a panel assembly, a chassis base on which a driving circuit is mounted and located on a rear of the panel assembly, a filter assembly mounted in front of the panel assembly, and a case that accommodates the panel assembly, the chassis base, and the filter assembly. The filter assembly includes a transparent substrate, an anti-reflection film, and an electromagnetic wave shielding filter attached to the rear surface of the substrate, and the electromagnetic wave shielding filter is grounded to the inner side of the case and is made of a metal mesh that includes a plating layer and a strike seed layer.
1. A filter assembly, comprising:
a substrate; and
an electromagnetic wave shielding filter attached to the substrate and comprising a polymer film and a metallic double layer structure arranged in a mesh pattern formed of a plurality of mesh-type metal meshes on the polymer film, wherein the metallic double layer structure comprises a strike layer and at least one plating layer on the strike layer,
wherein the electromagnetic wave shielding filter further comprises an edge portion encircling the mesh pattern and the width of the edge portion is greater than that of the mesh-type metal mesh.
2. The filter assembly of claim 1 , the metallic double layer structure is formed by the process comprising:
preparing a metal plate for plating;
forming a strike layer on the metal plate;
forming a plating layer comprising at least one layer on an upper surface of the strike layer;
attaching a highly cohesive polymer film on an upper surface of the plating layer; and
separating the polymer film from the metal plate causing the plating layer to transfer to a lower surface of the polymer film.
3. The filter assembly of claim 2 , the plating layer being arranged on the polymer film and the strike layer being arranged on the plating layer.
4. The filter assembly of claim 1 , the strike layer comprising a metal selected from the group consisting of Cu, Fe, Al, Zn, Co, Mg, Cr, Cd, Ti, Ag, Au, In, Ni and an alloy of a combination of these metals.
5. The filter assembly of claim 1 , the at least one plating layer comprising a material selected from the group consisting of copper and silver.
6. The filter assembly of claim 5 , the plating layer being 10-15 micrometers thick.
7. A plasma display panel, comprising:
a panel assembly;
a chassis base comprising a driving circuit, the chassis base being arranged on a rear of the panel assembly;
a filter assembly mounted in front of the panel assembly; and
a case that accommodates the panel assembly, the chassis base, and the filter assembly, the filter assembly comprises a transparent substrate, an anti-reflection film and an electromagnetic wave shielding filter, the filter being arranged on a rear surface of the substrate, the filter being grounded to an inner side of the case, the filter comprising a mesh pattern formed of a plurality of metal meshes that comprises a double layer structure that comprises a plating layer,
wherein the double layer structure comprises a strike layer and at least one plating layer on the strike layer,
wherein the electromagnetic wave shielding filter further comprises an edge portion encircling the mesh pattern and the width of the edge portion is greater than that of the metal mesh.
8. The plasma display panel of claim 7 , the metal mesh being formed by the process comprising:
forming the plating layer in a mesh shape on a metal plate;
attaching a highly cohesive polymer film to an upper surface of the plating layer; and
separating the polymer film from the metal plate causing the plating layer to separate from the metal plate while remaining attached to the polymer film.
9. The plasma display panel of claim 8 , the plating layer being arranged on the polymer film and the strike layer being arranged on the plating layer.
10. The plasma display panel of claim 7 , the strike layer serving as a seed layer during electrolytic plating, the strike layer comprising a metal selected from the group consisting of Cu, Fe, Al, Zn, Co, Mg, Cr, Cd, Ti, Ag, Au, In, Ni and an alloy thereof.
11. The plasma display panel of claim 7 , the at least one plating layer comprises a material selected from the group consisting of copper and silver.