IP Library Granted Patent US 7,247,883
Granted Patent B2
US 7,247,883 · App. 11/038,031 · Granted Jul 24, 2007

Thin film transistor having LDD structure

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Quick Facts
Patent No.
US 7,247,883
App. No.
11/038,031
Granted
Jul 24, 2007
Kind
B2
Abstract

A thin film transistor having a LDD structure that may improve its channel reliability and output characteristics. A semiconductor layer comprises source/drain regions, a channel region positioned between the source/drain regions, and an LDD region positioned between the channel region and a source/drain region, wherein a projected range of ions doped on the semiconductor layer extends to a first depth from the surface of the semiconductor layer in the LDD region.

Claims (12)

1. A thin film transistor (TFT), comprising:

a semiconductor layer including:

a source region and a drain region;

a channel region between the source region and the drain region; and

a lightly doped drain (LDD) region between the channel region and the source region or between the channel region and the drain region;

a gate insulation layer on the source region, the drain region, the channel region, and the LDD region; and

a gate electrode on the gate insulation layer,

wherein the gate insulation layer has a first thickness at portions on the source region, the drain region, and the LDD region and a second thickness at a portion on which the gate electrode is arranged, the second thickness being greater than the first thickness, and a projected range of ions doped in the semiconductor layer extends to a first depth from a surface of the semiconductor layer in the LDD region, and

wherein the difference between the second thickness and the first thickness equals the first depth.

2. The TFT of claim 1 , wherein the first depth satisfies the following mathematical expression:

(thickness of the semiconductor layer/2)−100 Å≦first depth≦(thickness of the semiconductor layer/2)+100 Å.  <Mathematical Expression 1>

3. The TFT of claim 1 , wherein the semiconductor layer is crystallized using an excimer laser annealing or sequential lateral solidification method.

Assignments (3)
MERGER Recorded Aug 29, 2012
From: SAMSUNG MOBILE DISPLAY CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 028868/0387 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2008
From: SAMSUNG SDI CO., LTD.
To: SAMSUNG MOBILE DISPLAY CO., LTD.
Reel/Frame 022024/0026 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 21, 2005
From: CHOI, KYU-HWAN
To: SAMSUNG SDI CO., LTD.
Reel/Frame 016198/0352 →