IP Library Granted Patent US 7,034,645
Granted Patent B2
US 7,034,645 · App. 11/038,880 · Granted Apr 25, 2006

Inductor coil and method for making same

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Quick Facts
Patent No.
US 7,034,645
App. No.
11/038,880
Granted
Apr 25, 2006
Kind
B2
Abstract

A high current, low profile inductor includes a conductor coil surrounded by magnetic material to form an inductor body. The inductor coil is formed from a flat plate which is cut into a sine-shaped configuration and then is folded in accordion fashion to create a helical coil.

Claims (19)

1. A method for making an inductor comprising:

forming an inductor element having first and second inductor ends from an electrically conductive material;

creating first and second terminal ends for the inductor element either by attaching the first and second terminal ends to first and second inductor ends of the inductor element or by forming the first and second terminal ends from the first and second inductor ends of the inductor element;

making a mixture comprising a resin and a non-ferrite powdered magnetic material;

compressing the mixture of resin and powdered magnetic material without liquefying the resin tightly around the inductor element to create an inductor body;

the compressing step being accomplished without injection molding;

leaving the first and second terminal ends outside the inductor body during the compressing step.

2. A method for making an inductor comprising:

forming an inductor element comprising a coil having an open center and an outside surface, the coil also having and first and second coil ends;

making a dry mixture comprising a dry resin and an insulated dry powdered magnetic material;

compressing the dry mixture around the outside surface of the coil and within the open center of the coil to create an inductor body without liquefying the dry mixture, whereby the inductor body engages the coil both within the coil open center and also the coil outside surface.

3. The method of claim 2 wherein the step of making a dry mixture comprises leaving ferrite out of the mixture.

4. The method of claim 2 and further comprising leaving the first and second coil ends outside the inductor body during the compressing step.

5. The method of claim 2 and further comprising attaching first and second leads to the first and second coil ends before the compressing step and leaving the first and second leads outside the inductor body after the compressing step.

6. The method of claim 2 wherein the compressing step causes the inductor body to be a single integral body.

7. A method for making an inductor comprising:

forming an inductor element comprising a coil having an open center and an outside surface, the coil also having and first and second coil ends;

making a dry mixture comprising a dry resin, a filler, a lubricant and an insulated dry powdered magnetic material;

compressing the dry mixture around the outside surface of the coil and within the open center of the coil to create an inductor body without liquefying the dry mixture, whereby the inductor body engages the coil both within the coil open center and also the coil outside surface.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE
Reel/Frame 049772/0898 →
RELEASE OF SECURITY INTEREST Recorded Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.; VISHAY TECHNO COMPONENTS, LLC; VISHAY EFI, INC.; VISHAY VITRAMON, INC.; SPRAGUE ELECTRIC COMPANY
Reel/Frame 049826/0312 →
SECURITY INTEREST Recorded Jun 12, 2019
From: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY-SILICONIX, INC.; VISHAY-SILICONIX; VISHAY SPRAGUE, INC.; VISHAY EFI, INC.; SPRAGUE ELECTRIC COMPANY; VISHAY GENERAL SEMICONDUCTOR, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049440/0876 →
SECURITY AGREEMENT Recorded Dec 10, 2015
From: VISHAY DALE ELECTRONICS, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 037261/0616 →