Package for housing an optoelectronic assembly

1. A package configured to house an optoelectronic assembly, the package comprising:

an insulating base having an upper surface;

an optoelectronic device attached directly to the upper surface of the insulating base;

a first metal member comprising a bottom wall and a top wall, the bottom wall of the first metal member being attached directly to the upper surface of the insulating base, the metal member being in electrical contact with an electrically conductive via within the insulating base; and

a metal cover having a rim located at a bottom portion thereof, the rim of the metal cover being configured to attach to the top wall of the first metal member to hermetically seal the metal cover to the insulating base.

2. The package of claim 1 , wherein the insulating base is a multilayer base comprising metal layers located at a plurality of levels of the insulating base and electrically coupled together.

3. The package of claim 1 , further comprising a heat dissipating device attached to the insulating base.

4. The package of claim 1 , wherein the insulating base comprises a ceramic material.

5. The package of claim 1 , wherein the insulating base has a polygonal shape.

6. The package of claim 1 , wherein the metal cover has a transparent portion.

7. A method for providing a hermetic enclosure, the method comprising:

attaching an optoelectronic device directly to an upper surface of an insulating base;

attaching a bottom wall of a first metal member directly to the upper surface of the insulating base;

positioning a metal cover over the optoelectronic device, the metal cover comprising a rim at a bottom portion thereof;

attaching the rim of the metal cover to a top wall of the first metal member to hermetically enclose the optoelectronic device;

forming a plurality of holes that extends from the upper surface of the insulating base to a lower surface of the insulating base; and

filling the plurality of holes with a conductive material, where the first metal member is in electrical contact with the plurality of holes filled with conductive material.

8. The method of claim 7 , further comprising:

attaching an integrated circuit adjacent to the optoelectronic device and directly to the upper surface of the insulating base, the integrated circuit being electrically coupled to the optoelectronic device;

positioning the metal cover over both the optoelectronic device and the integrated circuit located on the upper surface of the insulating base; and

attaching the rim of the metal cover to the top wall of the first metal hermetically enclose both the optoelectronic device and the integrated circuit.

9. The method of claim 8 , wherein attaching the integrated circuit adjacent to the optoelectronic device and directly to the upper surface of the insulating base comprises attaching both the optoelectronic device and the integrated circuit within an inner region of the first metal member.

10. The method of claim 8 , further comprising forming a first metal layer on the upper surface of the insulating base, the bottom wall of the first metal member being attached to the first metal layer disposed on the upper surface of the insulating base.

11. The method of claim 10 , further comprising attaching the first metal member directly to the insulating base using an upper adhesive layer located between the bottom wall of the first metal member and the first metal layer disposed on the upper surface of the insulating base.

12. The method of claim 10 , further comprising:

forming a second metal layer on the lower surface of the insulating base; and

patterning both the first and second metal layers into a plurality of conductive paths.

13. The method of claim 12 , further comprising

attaching a second metal member to the second metal layer formed on the lower surface of the insulating base, the second metal member being in contact with each of the plurality of filled holes.

14. The method of claim 13 , further comprising attaching the second metal member to the insulating base using a lower adhesive layer located between the second metal member and the second metal layer formed on the lower surface of the insulating base.

15. The method of claim 12 , further comprising:

attaching at least one electrical lead to the second metal layer formed on the lower surface of the insulating base; and

communicating an electrical signal from at least one of the optoelectronic device and the integrated circuit housed inside the metal cover to a component located external to the metal cover using the at least one electrical lead.

16. A packaged optical module, comprising:

a base formed of an electrically insulating material and having at least a first surface and a second surface, for mounting an optical device being in direct contact to the base at the first surface, wherein the base has a plurality of electrically conductive vias;

a sealing member formed of an electrically conducting material and attached directly to the base, the sealing member extending along a perimeter of the base with the optical device being located within an inner region of the sealing member, the sealing member being in electrical contact with at least one of the plurality of electrically conductive vias;

a heat dissipating device attached to the second surface of the base; and

a cover formed of the electrically conducting material, the cover being configured to attach to the sealing member on the base to provide a hermetic enclosure for the optical device.

17. A package configured to house an optoelectronic assembly, the package comprising:

an insulating base having an upper surface and a lower surface, and having a plurality of electrically conductive vias extending from the upper to the lower surface;

an optoelectronic device attached to the upper surface of the insulating base and in electrical contact with at least one of the vias;

a metal member comprising a bottom wall and a top wall, the bottom wall of the metal member being attached directly to the upper surface of the insulating base and in electrical contact with at least one other of the vias; and

a metal cover having a rim located at a bottom portion thereof, the rim of the metal cover being configured to attach to the top wall of the metal member to hermetically seal the metal cover to the insulating base.

18. The package of claim 17 , wherein the optoelectronic device is directly attached to the upper surface of the insulating base through an adhesive layer.

19. The package of claim 17 , further comprising a heat dissipating device attached to the insulating base.

20. The package of claim 17 , wherein the insulating base comprises a ceramic material.

21. The package of claim 17 , wherein at least some of the plurality of vias are positioned for use in resistance welding of the package and wherein at least some of the plurality of vias are used to conduct electrical current during optoelectronic device operation.