Patent Assignment
Reel/Frame 030006/0126
Assignment of Assignor's Interest
Recorded: 2013-03-15
Received: 2013-03-15
Pages: 6
Assignor
EMCORE CORPORATION
Executed: 2013-02-25
Assignee
SUMITOMO ELECTRIC DEVICE INNOVATIONS, U.S.A., INC.
2355 ZANKER ROAD, SAN JOSE, CA, 95131, UNITED STATES
Covered Properties
(83)
Reconfiguration and Protocol Adaptation of Optoelectronic Modules and Network Components
Application:
13/050,644 →
Optoelectronic Module with Integrated Monitoring Photodiode Array for a Parallel Optical Transmitter
Application:
12/726,165 →
Optoelectronic Module with Emi Shield
Application:
12/712,979 →
Vcsel Semiconductor Device
Application:
12/710,173 →
Power Monitoring Photodiode Array with Integrated, Current Sourced Reference Photodiode
Application:
12/582,545 →
Optical Transceiver with Optical Multiplexer on a Flexible Substrate
Application:
12/471,256 →
Embedded Parametric Monitoring of Optoelectronic Modules
Application:
12/437,815 →
Power Monitoring System for a Parallel Optical Transmitter
Application:
12/426,743 →
Simple Fiducial Marking for Quality Verification of High Density Circuit Board Connectors
Application:
12/367,366 →
Apparatus for Electro-Optical Device Connection
Application:
12/057,158 →
Modular Optical Transceiver
Application:
12/049,033 →
Parallel Optical Connector
Application:
12/019,472 →
Embedded Parametric Monitoring of Optoelectronic Modules
Application:
11/944,969 →
Integrated Optical Fiber and Electro-Optical Converter
Application:
11/854,319 →
Internal Emi Washer for Optical Transceiver with Parallel Optic Fiber Ribbon
Application:
11/846,271 →
Laser Adjustment in Integrated Optoelectronic Modules/Fiber Optic Cables
Application:
11/836,519 →
Passivation of Vertical Cavity Surface Emitting Lasers
Application:
11/835,834 →
Latching Mechanism for Pluggable Transceiver Module
Application:
11/745,112 →
Electro-Optical Transceiver
Application:
29/279,603 →
Fiducial Markings for Quality Verification of High Density Circuit Board Connectors
Application:
11/742,858 →
Parallel Electro-Optical Transceiver
Application:
29/286,011 →
Eye Safety in Electro-Optical Transceivers
Application:
11/732,996 →
Deposition Pattern for Eliminating Backside Metal Peeling During Die Separation in Semiconductor Device Fabrication
Application:
11/728,751 →
Pluggable Transceiver Module
Application:
11/698,550 →
Identification and Authorization of Optoelectronic Modules by Host System
Application:
11/620,317 →
Optical Transceiver for 40 Gigabit/Second Transmission
Application:
11/551,047 →
Flexible Substrate for Routing Fibers in an Optical Transceiver
Application:
11/517,868 →
Flexible Substrate for Routing Fibers in an Optical Transceiver
Application:
11/517,870 →
10GBASE-LX4 Optical Transceiver in Xfp Package
Application:
11/510,157 →
Xfi-Xaui Integrated Circuit for Use with 10GBASE-LX4 Optical Transceivers
Application:
11/510,155 →
Optical Mouse Using Vcsels
Application:
11/499,210 →
Method of Fabricating Single Mode Vcsel for Optical Mouse
Application:
11/441,372 →
Ferrule for Optical Fiber Connector
Application:
11/353,556 →
Latching Mechanism for Pluggable Transceiver
Application:
11/305,883 →
Method for Eliminating Backside Metal Peeling During Die Separation
Application:
11/280,783 →
Serial to Parallel Electrical Transceiver
Application:
29/242,351 →
Flexible Substrate for Routing Fibers in an Optical Transceiver
Application:
11/266,152 →
Fiducial Markings for Quality Verification of High Density Circuit Board Connectors
Application:
11/240,402 →
Modular Optical Transmitter for Wwdm Transceivers
Application:
11/185,008 →
Optical Device Latching Mechanism
Application:
11/095,676 →
Optical Module Having Case Grounding Using Bypass Capacitor
Application:
11/049,622 →
Package for Housing an Optoelectronic Assembly
Application:
11/039,174 →
Method for Measuring Vcsel Reverse Bias Leakage in an Optical Module
Application:
10/989,175 →
Integrated Optical Fiber and Electro-Optical Converter
Application:
10/965,984 →
Apparatus for Electrical and Optical Interconnection
Application:
10/955,876 →
Apparatus for an Electro-Optical Device Connection
Application:
10/954,880 →
Flexible Substrate for Routing Fibers in an Optical Transceiver
Application:
10/898,086 →
Electro-Optical Converter
Application:
29/208,957 →
Modular Optical Transceiver
Application:
10/879,775 →
Modular Optical Receiver
Application:
10/896,721 →
Fiber Optic Transceiver Module with Rigid and Flexible Circuit Boards
Application:
10/866,265 →
Method of Monitoring an Optical Signal from a Laser
Application:
10/859,833 →
Transparent Substrate and Hinged Optical Assembly
Application:
10/832,726 →
Optical Module with Latching/Delatching Mechanism
Application:
10/803,424 →
Optical Communications Adapter, System and Method
Application:
10/748,982 →
Communications Adapter Module
Application:
10/748,978 →
Methods for Fabricating an Aligned Optoelectronic Waveguide Circuit
Application:
10/722,204 →
Low-Profile Package for Housing an Optoelectronic Assembly
Application:
10/706,209 →
Method of Guiding an Optical Signal
Application:
10/662,768 →
Optical Packages and Methods to Manufacture the Same
Application:
10/652,093 →
Package for Housing an Optoelectronic Assembly
Application:
10/444,342 →
Method to Align Optical Components to a Substrate and Other Optical Components
Application:
10/368,707 →
Alignment Apertures in an Optically Transparent Substrate
Application:
10/352,477 →
Electro-Optic Interconnect Circuit Board
Application:
10/352,472 →
Method and Apparatus for Parallel Optical Transceiver Module Assembly
Application:
10/352,725 →
High-Density Fiber-Optic Module with Multi-Fold Flexible Circuit
Application:
10/263,942 →
Method of Attenuating an Optical Signal
Application:
10/235,750 →
Transparent Substrate and Hinged Optical Assembly
Application:
10/219,749 →
Embedded Electromagnetic Interference Shield
Application:
10/213,540 →
Assembly for Aligning an Optical Array with Optical Fibers
Application:
10/211,732 →
Dynamically Configurable Backplane
Application:
10/158,306 →
Alignment Apertures in an Optically Transparent Substrate
Application:
10/136,726 →
Connector Housing for Fiber-Optic Module
Application:
10/080,171 →
Method to Assemble Optical Components to a Substrate
Application:
10/075,142 →
Optical Attenuating Underchip Encapsulant
Application:
10/073,462 →
Method to Diffract and Attenuate an Optical Signal
Application:
10/044,866 →
Communications Assembly Disabling Mechanism
Application:
10/037,507 →
Method of Differentially Connecting Photonic Devices
Application:
09/957,257 →
Transparent Substrate and Hinged Optical Assembly
Application:
09/951,646 →
Electro-Optic Interconnect Circuit Board
Application:
09/941,260 →
Method to Align Optical Components to a Substrate and Other Optical Components
Application:
09/920,917 →
C and L Band Laminated Fabric Optical Amplifier
Application:
09/910,567 →
Method of Improving the Fabrication of Etched Semiconductor Devices
Application:
09/872,747 →