System and method for an improved susceptor
View Patent ↗A susceptor including a substrate support and a conductor is provided. The substrate support includes a conductive element, a contact bonded to the conductive element, and a bushing. The conductor is disposed through the bushing and is bonded to the contact. The substrate support can also include a conductive spreader between the contact and the conductive element. A method for fabricating a susceptor is also provided. The method comprises forming a plate including a bushing preform, sintering or hot-pressing a conductive element and a contact between a ceramic layer and the plate to produce a substrate support, forming a conductor opening into the substrate support and through the bushing preform to the contact, and bonding a conductor into the conductor opening.
1. A substrate support for a susceptor for use in a processing chamber, the substrate support comprising:
an insulating body;
a conductive element disposed within the insulating body;
a contact disposed within the insulating body and in electrical communication with the conductive element; and
a bushing disposed within the insulating body such that the contact is disposed between the bushing and the conductive element, the bushing comprising a plate member with a bore therethrough.
2. The substrate support of claim 1 wherein the insulating body is formed of a ceramic.
3. The substrate support of claim 1 wherein the conductive element comprises a heating element.
4. The substrate support of claim 1 wherein the conductive element comprises a RF grid.
5. The substrate support of claim 1 wherein the conductive element comprises an electrostatic electrode.
6. The substrate support of claim 1 wherein the contact comprises a cylinder.
7. The substrate support of claim 1 wherein the contact comprises a ring.
8. The substrate support of claim 1 wherein the contact comprises a conductive material with a coefficient of thermal expansion similar to that of the substrate support.
9. The substrate support of claim 8 wherein the conductive material includes molybdenum.
10. The substrate support of claim 8 wherein the conductive material includes tungsten.
11. The substrate support of claim 1 wherein the contact is diffusion bonded to the conductive element.
12. The substrate support of claim 1 wherein the bushing comprises a conductive material with a coefficient of thermal expansion similar to that of the substrate support.
13. The substrate support of claim 12 wherein the conductive material includes molybdenum.
14. The substrate support of claim 12 wherein the conductive material includes tungsten.
15. The substrate support of claim 1 wherein the bushing comprises a shape that is non-circular.
16. A susceptor for use in a processing chamber, the susceptor comprising:
a substrate support including
an insulating body;
a conductive element disposed within the insulating body,
a contact disposed within the insulating body and in electrical communication with the conductive element, and
a bushing disposed within the insulating body such that the contact is disposed between the bushing and the conductive element, the bushing comprising a plate member with a bore therethrough;
a support shaft coupled to the substrate support; and
a conductor in electrical communication with the contact of the substrate support and extending through both the bushing and the support shaft.
17. The susceptor of claim 16 wherein the conductor is brazed to the contact.
18. The susceptor of claim 16 wherein the conductor is disposed through the bore in the bushing.
19. The susceptor of claim 18 wherein the conductor is brazed to the bushing.
20. The susceptor of claim 18 wherein the conductor is further brazed to the contact.