Method of fabricating MRAM cells

1. A method of fabricating an MRAM cell, comprising:

providing a workpiece having at least one magnetic tunnel junction (MTJ) formed thereon;

forming an insulating layer made of non-conductive, isolating material over the at least one MTJ;

using a damascene process to form at least two adjacent first trenches in the insulating layer;

filling the first trenches in the insulating material with a conductive material; and

polishing the conductive material to form conductive lines;

etching at least a second trench in the insulating layer between the conductive lines, the second trench having side walls and a bottom surface at a specified aspect ratio;

depositing a ferromagnetic liner material at least over the conductive lines and the second trench; and

removing the ferromagnetic liner material from the bottom surface of the second trench to form ferromagnetic liners of the conductive lines.

2. The method of claim 1 , wherein the ferromagnetic liner material is deposited using a sputter-deposition technique.

3. The method of claim 1 , wherein the ferromagnetic liner material is etched using a sputter-etch technique.

4. The method of claim 1 , wherein an aspect ratio of the second trench is at least 0.5.

5. The method of claim 1 , wherein an aspect ratio of the second trench is at least 1.

6. The method of claim 1 , further comprising:

forming an etch stop layer in the insulating layer to stop etching of the second trench in the insulating layer.

7. The method of claim 1 , further comprising:

forming a first diffusion barrier layer in between the insulating layer and the conductive material of conductive lines.

8. The method of claim 7 , wherein the first diffusion barrier layer resists etching the second trench in the insulating layer.

9. The method of claim 7 , further comprising:

forming a second diffusion barrier layer in the second trench before depositing the ferromagnetic liner material.

10. The method of claim 9 , wherein the first and second diffusion barrier layers are two-layers structures, respectively, comprised of a first sublayer of metal nitride and a second sublayer of metal.

11. An MRAM cell fabricated by a method including providing a workpiece having at least one magnetic tunnel junction (MTJ) formed thereon, forming an insulating layer made of non-conductive, isolating material over the at least one MTJ, using a damascene process to form at least two adjacent first trenches in the insulating layer, filling the first trenches in the insulating material with a conductive material, polishing the conductive material to form conductive lines, etching at least a second trench in the insulating layer in between the conductive lines, the second trench having side walls and a bottom surface at a specified aspect ratio, depositing a ferromagnetic liner material at least over the conductive lines and the second trench, and removing the ferromagnetic liner material from the bottom surface of the second trench to form ferromagnetic liners of the conductive lines, comprising:

an insulating layer, the insulating layer having at least two first trenches and at least a second trench; and

a ferromagnetic liner material.

12. The MRAM cell of claim 11 , comprising:

at least one magnetic tunneling junction (MTJ);

an insulating layer made of non-conductive, isolating material over the at least one MTJ; and

at least two adjacent conductive lines in the insulating layer, each one of the conductive lines having a ferromagnetic liner made of ferromagnetic material comprised of top and side wall layers, the ferromagnetic liner having rounded corners connecting the top and side wall layers.