Sapphire/gallium nitride laminate having reduced bending deformation
View Patent ↗The present invention relates to a sapphire/gallium nitride laminate, wherein a curvature radius thereof is positioned on the right side of a first curve plotted from the following functional formula (I): Y=Y 0 +A·e −(x−1)/T (I) wherein Y is the curvature radius (m) of a sapphire/gallium nitride laminate, X is the thickness (μm) of a gallium nitride film, Y 0 is 5.47±0.34, A is 24.13±0.50, and T is 0.56±0.04. The inventive laminate can be advantageously used in the manufacture of a high quality electronic device.
1. A sapphire/gallium nitride laminate comprising an embossed aluminum nitride (AlN) interface layer disposed between a GaN film and a sapphire substrate, the embossing density being 25 to 500/μm 2 , wherein said laminate is curved with a curvature radius which is positioned on the right side of a first curve plotted from the following functional formula (I):
Y=Y 0 +A·e −(x−1)/T (I)
wherein
Y is the curvature radius (m) of a sapphire/gallium nitride laminate,
X is the thickness (μm) of a gallium nitride film,
Y 0 is 5.47±0.34,
A is 24.13±0.50, and
T is 0.56±0.04.
2. The sapphire/gallium nitride laminate of claim 1 , wherein the curvature radius thereof is positioned on the left side of a second curve plotted from the formula (I) when Y 0 is 5.44±0.55, A is 72.52±0.74 and T is 1.15±0.04.
3. The sapphire/gallium nitride laminate of claim 1 , wherein the curvature radius thereof is positioned on a second curve plotted from the formula (I) when Y 0 is 5.44±0.55, A is 72.52±0.74 and T is 1.15±0.04.
4. The sapphire/gallium nitride laminate of claim 1 , wherein the AlN interface layer is formed by treating the sapphire substrate successively with gaseous ammonia (NH3), a gas mixture of hydrogen chloride (HCl) and ammonia and gaseous ammonia.
5. The sapphire/gallium nitride laminate of claim 4 , wherein a gas mixture of HCl and NH 3 has a mix ratio ranging 1:10 to 1:20 by volume.
6. The sapphire/gallium nitride laminate of claim 1 , wherein the gallium nitride film has a thickness of 0.5 to 20 μm.
7. The sapphire/gallium nitride laminate of claim 1 , wherein the gallium nitride film has a thickness of 80 to 200 μm.
8. An electronic device which comprises the sapphire/gallium nitride laminate of claim 1 as a substrate.
9. The electronic device of claim 8 , which is a light emitting device.
10. A gallium nitride film separated from the sapphire/gallium nitride laminate of claim 1 .
11. The gallium nitride film of claim 10 , which has a thickness of 80 to 200 μm.