Surface acoustic wave duplexer having enhanced isolation performance
A miniaturized SAW duplexer includes SAW filters carried on a monolithic piezoelectric chip that is mounted inside a multi-layered ceramic package. A phase matching stripline is embedded diagonally and between two ground layers of the multi-layered ceramic package and is positioned between a wall of vias for significantly minimizing coupling between transmitted and received filters by providing an improved ground shielding of the phase matching stripline. Coupling within the same filter and coupling between the SAW filters are suppressed and thus provide enhanced isolation performance. for the SAW duplexer.
1. A duplexer comprising:
a multi-layered package;
a piezoelectric crystal chip carried within the package;
first and second SAW filters carried on the piezoelectric crystal chip, the first and second SAW filters having different passband frequencies, wherein the first SAW filter forms a received filter and the second SAW filter forms a transmitted filter, and wherein the first and second SAW filters are mounted within the multi-layer package;
a phase matching stripline embedded generally diagonally within the multi-layered package between two ground layers carried therein; and
at least two rows of vias positioned on opposing sides of the stripline for providing ground shielding so as to reduce coupling between the two SAW filters.
2. A duplexer as recited in claim 1 , wherein the phase matching stripline is positioned to form an angle having a value ranging from approximately 30° to approximately 60° with respect to a side of the package.
3. A duplexer as recited in claim 2 , wherein the stripline comprises a serpentine styled structure.
4. A duplexer comprising:
a package;
a piezoelectric crystal chip carried within the package;
first and second SAW filters carried on the piezoelectric crystal chip, the first and second SAW filters having different passband frequencies, wherein the first SAW filter forms a received filter and the second SAW filter forms a transmitted filter;
a phase matching stripline positioned between two ground layers carried within the package, wherein the phase matching stripline is diagonally positioned with respect to a side of the package; and
a plurality of vias arranged on opposing sides of the stripline for providing ground shielding, thus reducing coupling between the first and second SAW filters.
5. A duplexer as recited in claim 4 , wherein the phase matching stripline is formed as a serpentine structure.
6. A duplexer as recited in claim 4 , wherein at least one of the first and second SAW filters comprises resonators, and wherein the duplexer comprises a metal insert positioned between the resonators of the at least one of the first and second filters so as to reduce a coupling between the resonators and for enhancing an isolation performance of the duplexer.
7. A duplexer as recited in claim 6 , wherein the metal insert comprises a shape selected from at least one of a diamond, a quadrilateral, a polygon, a triangle, a circle, and an arcuate form.
8. A duplexer as recited in claim 6 , wherein the metal insert is formed from a material selected from Al, Al alloy, and a material that forms electrodes of the resonators.
9. A duplexer as recited in claim 4 , further comprising a ground metal pad located between the first SAW filter and the second SAW filter for reducing a coupling therebetween and enhancing isolation performance of the duplexer.
10. A duplexer as recited in claim 9 , wherein the ground metal pad is formed from a material selected from Al, Al alloy, and a material that forms electrodes of the resonators.