IP Library Granted Patent US 7,161,219
Granted Patent B2
US 7,161,219 · App. 11/050,797 · Granted Jan 9, 2007

MRAM devices with fine tuned offset

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Quick Facts
Patent No.
US 7,161,219
App. No.
11/050,797
Granted
Jan 9, 2007
Kind
B2
Abstract

A MRAM cell structure is disclosed as containing an additional ferromagnetic layer and coupling layer between the third ferromagnetic layer and the anti-ferromagnetic layer. The additional ferromagnetic layer affects the demagnetization field to which the free layer is exposed, thereby reducing any bias introduced to the free layer. Further, by adjusting the thickness of the additional ferromagnetic layer, the effects of Neel coupling on the free layer are reduced.

Claims (40)

1. A magnetoresistive random access memory (MRAM) cell, comprising:

a first ferromagnetic layer;

a barrier layer formed over said first ferromagnetic layer;

a second ferromagnetic layer formed over said barrier layer;

a first coupling layer formed over said second ferromagnetic layer;

a third ferromagnetic layer formed over said first coupling layer;

a second coupling layer formed over said third ferromagnetic layer;

a fourth ferromagnetic layer formed over said second coupling layer; and

an anti-ferromagnetic layer formed over said fourth ferromagnetic layer.

2. A memory, comprising:

a plurality of magnetoresistive random access memory (MRAM) cells, each of said MRAM cells comprising:

a first ferromagnetic layer;

a barrier layer formed over said first ferromagnetic layer;

a second ferromagnetic layer formed over said barrier layer;

a first coupling layer formed over said second ferromagnetic layer;

a third ferromagnetic layer formed over said first coupling layer;

a second coupling layer formed over said third ferromagnetic layer;

a fourth ferromagnetic layer formed over said second coupling layer; and

an anti-ferromagnetic layer formed over said fourth ferromagnetic layer.

3. A processor system, comprising:

a processor; and

a memory coupled to said processor, said memory containing a plurality of magnetoresistive random access memory (MRAM) cells, each of said MRAM cells comprising:

a first ferromagnetic layer;

a barrier layer formed over said first ferromagnetic layer;

a second ferromagnetic layer formed over said barrier layer;

a first coupling layer formed over said second ferromagnetic layer;

a third ferromagnetic layer formed over said first coupling layer;

a second coupling layer formed over said third ferromagnetic layer;

a fourth ferromagnetic layer formed over said second coupling layer; and

an anti-ferromagnetic layer formed over said fourth ferromagnetic layer.

4. A layered structure, comprising:

a plurality of layers of ferromagnetic material spaced apart by respective spacer layers, wherein

a demagnetization field of a first ferromagnetic layer is substantially absent from at least a second layer of said plurality of ferromagnetic layers when said layered structure is in the presence of a magnetic field.

5. The MRAM cell of claim 1 , further comprising:

a seed layer formed below said first ferromagnetic layer.

6. The MRAM cell of claim 5 , wherein said seed layer is formed of tantalum.

7. The MRAM cell of claim 1 , wherein said anti-ferromagnetic layer is formed of iridium manganese.

8. The MRAM cell of claim 1 , wherein said anti-ferromagnetic layer is formed of platinum manganese.

9. The MRAM cell of claim 1 , wherein said first and second coupling layers comprise ruthenium.

10. The MRAM cell of claim 1 , wherein said barrier layer comprises aluminum oxide.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 1, 2016
From: MICRON TECHNOLOGY, INC
To: OVONYX MEMORY TECHNOLOGY, LLC
Reel/Frame 039974/0496 →