IP Library Granted Patent US 7,316,606
Granted Patent B2
US 7,316,606 · App. 11/053,727 · Granted Jan 8, 2008

Auxiliary airflow system

Assignee: Intel Corporation
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Quick Facts
Patent No.
US 7,316,606
App. No.
11/053,727
Granted
Jan 8, 2008
Kind
B2
Abstract

A method according to one embodiment may include providing a chassis comprising at least one selectively deployable fan disposed within the chassis. The method of this embodiment may also include moving the fan from a stowed configuration to a deployed configuration within the chassis and energizing the at least one fan. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Claims (33)

1. A system comprising:

a frame comprising at least one chassis;

an airflow path through said chassis including an intake region and an exhaust region;

at least one circuit board configured to be coupled to said at least one chassis, said at least one circuit board including at least one heat generating component;

a primary cooling system including at least one fan configured to provide a first airflow through said airflow path to convectively cool said at least one heat generating component of said at least one circuit board;

a selectively deployable fan assembly comprising at least one fan; and

a drive system configured to move said at least one fan assembly between a stowed configuration wherein said fan assembly is at least partially retracted into and removed from said airflow path to permit airflow through said airflow path and a deployed configuration wherein said fan assembly is positioned adjacent to said intake region and is configured to provide a second airflow through said airflow path to convectively cool said at least one heat generating component of said at least one circuit board.

2. A system according to claim 1 , wherein said chassis comprises an Advanced Telecommunications Computing Architecture chassis.

3. A system according to claim 1 , wherein said selectively deployable fan assembly is positioned adjacent to a rear portion of an air inlet plenum when said fan assembly is in said stowed configuration.

4. A system according to claim 1 , wherein said selectively deployable fan assembly is positioned adjacent to said intake region when said fan assembly is in said deployed configuration.

5. A system according to claim 1 , wherein said drive system comprises a rack coupled to said chassis and a pinion coupled to said fan assembly, and said pinion is coupled to a motor capable of driving said pinion.

6. A system according to claim 1 , further comprising a control system comprising a temperature sensor, said fan assembly moving between said stowed configuration and said deployed configuration in response to a temperature measured by said temperature sensor.

7. A system according to claim 6 , said fan assembly moving between said stowed configuration and said deployed configuration based on changes in a temperature measured by said temperature sensor.

8. An apparatus comprising:

a chassis;

an airflow path through said chassis including an intake region and an exhaust region;

a selectively deployable fan assembly comprising at least one fan, said selectively deployable fan assembly movable between a deployed configuration wherein said fan assembly is positioned adjacent to said intake region and is configured to provide an airflow through said airflow path and a stowed configuration wherein said fan assembly is at least partially retracted into and removed from said airflow path to permit aifflow through said aifflow path; and

a drive system configured to move said fan assembly between said stowed configuration and said deployed configuration.

9. An apparatus according to claim 8 , wherein said chassis comprises an Advanced Telecommunication Computing Architecture chassis.

10. An apparatus according to claim 8 , wherein said selectively deployable fan assembly is positioned adjacent to a rear portion of an air inlet plenum of said chassis when said selectively deployable fan assembly is in said stowed configuration.

11. An apparatus according to claim 8 , wherein said selectively deployable fan assembly is in a generally horizontal orientation when said selectively deployable fan assembly is in said stowed configuration.

12. An apparatus according to claim 8 , wherein said selectively deployable fan assembly is in generally vertical orientation when said selectively deployable fan assembly is in said deployed configuration.

13. An apparatus according to claim 8 , wherein said drive system comprises a guide rail capable of controlling movement of said selectively deployable fan assembly between said stowed configuration and said deployed configuration.

14. An apparatus according to claim 8 , wherein said drive system comprises a rack and pinion.

15. An apparatus according to claim 8 , further comprising a rotation means capable of moving said fan assembly between a generally horizontal orientation and a generally vertical orientation.

16. An apparatus according to claim 15 , wherein said rotation means comprises a spring biasing said fan assembly toward said generally vertical orientation and further comprising a guide capable of pivoting said fan assembly between said generally horizontal orientation and said generally vertical orientation.

17. A method for providing increased airflow through a chassis comprising:

providing a chassis comprising at least one selectively deployable fan assembly and an airflow path through said chassis including an intake region and an exhaust region;

moving said at least one fan assembly from a stowed configuration wherein said at least one fan assembly is at least partially retracted into and removed from an airflow path to permit airflow through said airflow path to a deployed configuration wherein said at least one fan assembly is positioned adjacent to said intake region and is configured to provide an airflow through said airflow path; and

energizing said at least one fan assembly when said at least one fan assembly is in said deployed configuration.

18. A method according to claim 17 , wherein said at least one fan assembly is disposed in a rear portion of an air inlet plenum when said at least one fan assembly is in said stowed configuration.

19. A method according to claim 18 , wherein said at least one fan assembly is adjacent to said intake region of an air inlet plenum when said at least one fan assembly is in said deployed configuration.

20. A method according to claim 17 , wherein moving said at least one fan assembly from said stowed configuration to said deployed configuration comprises rotating said fan assembly from a generally horizontal orientation to a generally vertical orientation.

Assignments (4)
SECURITY INTEREST Recorded Jan 4, 2018
From: RADISYS CORPORATION
To: MARQUETTE BUSINESS CREDIT, LLC
Reel/Frame 044540/0080 →
SECURITY INTEREST Recorded Jan 3, 2018
From: RADISYS CORPORATION; RADISYS INTERNATIONAL LLC
To: HCP-FVG, LLC
Reel/Frame 044995/0671 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 5, 2009
From: INTEL CORPORATION
To: RADISYS CORPORATION
Reel/Frame 022203/0788 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 27, 2005
From: SHIPLEY, JAMES C.; LEIJA, JAVIER; GONZALES, CHRISTOPHER A.; LUCERO, CHRISTOPHER D
To: INTEL CORPORATION
Reel/Frame 016173/0773 →
Continuity (1)
Related Publication 20060199498A1 · Sep 7, 2006