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App. No. 11/055,940 · Confirmation No. 4810

Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby

Abandoned -- Failure to Respond to an Office Action View Publication ↗
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2007-07-13 ABN Abandonment 2 View
2007-07-13 BIB Bibliographic Data Sheet 1 View
2006-12-11 CTNF Non-Final Rejection 7 View
2006-12-11 1449 List of References cited by applicant and considered by examiner 2 View
2006-12-11 892 List of references cited by examiner 1 View
2006-12-11 BIB Bibliographic Data Sheet 1 View
2006-12-11 FWCLM Index of Claims 1 View
2006-12-11 SRFW Search information including classification, databases and other search related notes 1 View
2006-12-04 SRNT Examiner's search strategy and results 2 View
2006-10-10 ELC. Response to Election / Restriction Filed 1 View
2006-10-10 N417 Electronic Filing System Acknowledgment Receipt 2 View
2006-09-19 CTRS Requirement for Restriction/Election 3 View
2006-09-19 FWCLM Index of Claims 1 View
2006-09-19 BIB Bibliographic Data Sheet 1 View
2005-05-12 136A Authorization for Extension of Time all replies 1 View
2005-02-10 TRNA Transmittal of New Application 2 View
2005-02-10 SPEC Specification 23 View
2005-02-10 CLM Claims 16 View
2005-02-10 ABST Abstract 1 View
2005-02-10 DRW Drawings-only black and white line drawings 26 View
2005-02-10 OATH Oath or Declaration filed 18 View
2005-02-10 WFEE Fee Worksheet (SB06) 1 View
2005-02-10 WFEE Fee Worksheet (SB06) 1 View
2005-02-10 A.PE Preliminary Amendment 1 View
2005-02-10 SPEC Specification 1 View
2005-02-10 CLM Claims 3 View
2005-02-10 REM Applicant Arguments/Remarks Made in an Amendment 1 View
2005-02-10 IDS Information Disclosure Statement (IDS) Form (SB08) 4 View
2005-02-10 WFEE Fee Worksheet (SB06) 1 View
2005-02-10 WCLM Claims Worksheet (PTO-2022) 1 View
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Quick Facts
App. No.
11/055,940
Filed
2005-02-10
Pub. No.
US20050170647A1
Art Unit
2818