Patent Assignment
Reel/Frame 027873/0022
Assignment of Assignor's Interest
Recorded: 2012-03-15
Pages: 14
Assignor
ALLVIA, INC.
Executed: 2011-10-20
Assignee
INVENSAS CORPORATION
2702 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(21)
Packaging Substrates for Integrated Circuits and Soldering Methods
PCT:
PCT/US2004/042204 ↗
Integrated Circuits and Packaging Substrates with Cavities, and Attachment Methods Including Insertion of Protruding Contact Pads into Cavities
PCT:
PCT/US2004/042228 ↗
Dielectric Trenches, Nickel/Tantalum Oxide Structures, and Chemical Mechanical Polishing Techniques
PCT:
PCT/US2007/068051 ↗
Agitation of Electrolytic Solution in Electrodeposition
PCT:
PCT/US2008/062027 ↗
Brim and Gas Escape for Non-Contact Wafer Holder
Patent:
6,203,661 →
Application:
09/457,042 →
Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners
Application:
09/491,456 →
Non-Contact Workpiece Holder Using Vortex Chuck with Central Gas Flow
Patent:
6,427,991 →
Application:
09/633,086 →
Integrated circuits and methods for their fabrication
Application:
09/673,392 →
Plasma Processing Comprising Three Rotational Motions of an Article Being Processed
Patent:
6,749,764 →
Application:
09/713,137 →
Articles Holders with Sensors Detecting a Type of Article Held by the Holder
Semiconductor Structures with Cavities, and Methods of Fabrication
Clock distribution networks and conductive lines in semiconductor integrated circuits
Application:
10/375,218 →
Publication:
US 2003/0197239
Detection and Handling of Semiconductor Wafers and Wafers-Like Objects
Plasma processing comprising three rotational motions of an article being processed
Application:
10/627,038 →
Publication:
US 2004/0016406
Article Holders with Sensors Detecting a Type of Article Held by the Holder
Clock distribution networks and conductive lines in semiconductor integrated circuits
Application:
10/956,827 →
Publication:
US 2005/0051887
Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby
Application:
11/055,940 →
Publication:
US 2005/0170647
Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities
Application:
11/136,799 →
Publication:
US 2005/0212127
Attachment of integrated circuit structures and other substrates to substrates with vias
Application:
11/253,490 →
Publication:
US 2006/0076661
Clock Distribution Networks and Conductive Lines in Semiconductor Integrated Circuits
Application:
11/559,805 →
Publication:
US 2007/0069377
Back-Side Contact Pads
Application:
60/030,425 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 13, 2001
From: HALAHAN, PATRICK B.
To: TRU-SI TECHNOLOGIES, INC.
Reel/Frame 012176/0855 →
Assignment of Assignor's Interest
Sep 19, 2001
From: KRETZ, FRANK E.; BERGER, ALEXANDER J.; CASAROTTI, SEAN A.
To: TRU-SI TECHNOLOGIES, INC.
Reel/Frame 012189/0154 →
Assignment of Assignor's Interest
May 3, 2007
From: SAVASTIOUK, SERGEY; KOSENKO, VALENTIN; ROMAN, JAMES J.
To: TRU-SI TECHNOLOGIES, INC.
Reel/Frame 019244/0246 →
Change of Name
Mar 10, 2011
From: TRU-SI TECHNOLOGIES, INC.
To: ALLVIA, INC.
Reel/Frame 025932/0615 →