Heat dissipation mechanism for electronic apparatus
View Patent ↗This disclosure presents a heat dissipation mechanism, which conducts generated heat of a thermal device to the housing of an electronic apparatus by a metal piece fastened between the thermal device and electronic apparatus, and then dissipates heat into the air through multiple holes opened over an apparatus shell. Besides, the presented mechanism is also suitable to mini-size, portable electronic apparatus to solve the thermal dissipation technique thereof.
1. A heat dissipation mechanism for electronic apparatus comprising:
a substrate, at least one thermal device being fastened on said substrate;
a housing, for enclosing said substrate, wherein said housing comprises a heat dissipation region having an inner surface and a plurality of openings penetrating through said housing; and
a heat conductive metal piece, for connecting said at least one thermal device and the inner surface of said heat dissipation region, wherein said heat conductive metal piece is attached to said at least one thermal device by a heat conductive adhesive material, and said inner surface has a hollow structure for engaging and fastening said heat conductive metal piece.
2. The heat dissipation mechanism of claim 1 , wherein said heat conductive metal piece has a structure having same shape as said hollow structure, such that said structure directly engages said hollow structure of said inner surface.
3. The heat dissipation mechanism of claim 1 , wherein said heat conductive metal piece is flexible.
4. The heat dissipation mechanism of claim 1 , wherein said heat conductive metal piece has a plurality of bulges for individually inserting into said plurality of openings of said heat dissipation region, such that each of said plurality of bulges and said housing form a recess to prevent said heat conductive metal piece from being touched by user.
5. The heat dissipation mechanism of claim 1 , wherein said heat conductive metal piece is slice-shaped and is attached to said housing.
6. A heat dissipation mechanism for applying to the portable electronic apparatus comprising:
a substrate, at least one thermal device being fastened on said substrate;
a housing, for enclosing said substrate, wherein said housing has at least one heat dissipation region having an inner surface and a plurality of openings penetrating through said housing; and
a heat conductive metal piece, for connecting said at least one thermal device and the inner surface of said at least one heat dissipation region, wherein said heat conductive metal piece and said at least one thermal device form a contact area approximatively equivalent to area of said at least one thermal device occupied in said substrate, and said housing is formed of a material with low thermal conduction coefficient.
7. The heat dissipation mechanism of claim 6 , wherein said heat conductive metal piece is attached to said at least one thermal device by a heat conductive adhesive material.
8. The heat dissipation mechanism of claim 6 , wherein said material with low thermal conduction coefficient comprises acrylic.
9. The heat dissipation mechanism of claim 6 , wherein said material with low thermal conduction coefficient comprises plastic.
10. The heat dissipation mechanism of claim 6 , wherein said plurality of openings are mesh-shaped, and said plurality of openings has a size and a height capable of preventing said heat conductive metal piece from being touched by user.
11. The heat dissipation mechanism of claim 10 , wherein the height of each of said plurality of opening is thicker than 1 mm, and the size of each of said plurality of opening is smaller than 2 mm.
12. The heat dissipation mechanism of claim 6 , wherein said plurality of openings are dot-shaped.
13. The heat dissipation mechanism of claim 10 , wherein said plurality of openings are strip-shaped.
14. The heat dissipation mechanism of claim 13 , wherein the height of each of said plurality of opening is thicker than 1 mm and the size of each of said plurality of opening is smaller than 1.5 mm.
15. The heat dissipation mechanism of claim 6 , wherein said heat conductive metal piece is attached to said at least one heat dissipation region with a fixing component.
16. The heat dissipation mechanism of claim 15 , wherein said fixing component comprises a bolt.
17. The heat dissipation mechanism of claim 15 , wherein said fixing component comprises a screw.
18. The heat dissipation mechanism of claim 6 , wherein said heat conductive metal piece has a structure that directly attaches to the inner surface of said at least one heat dissipation region without any fixing component.
19. The heat dissipation mechanism of claim 6 , wherein said heat conductive metal piece is flexible.
20. The heat dissipation mechanism of claim 6 , wherein said heat conductive metal piece has a plurality of bulges for respectively inserting into said plurality of openings of said at least one heat dissipation region, such that each of said plurality of bulges and said housing form a recess to prevent said heat conductive metal piece from being touched by user.
21. The heat dissipation mechanism of claim 18 , wherein said inner surface has a hollow structure for fastening said structure of said heat conductive metal piece.
22. The heat dissipation mechanism of claim 6 , wherein said heat conductive metal piece is slice-shaped and is attached to said housing.