IP Library › Assignment 023348/0301
Patent Assignment
Reel/Frame 023348/0301

Assignment of Assignor's Interest

Recorded: 2009-10-08 Pages: 8
Assignor
SILICON INTEGRATED SYSTEMS CORP.
Executed: 2009-09-23
Assignee
TAICHI HOLDINGS, LLC
2711 CENTERVILLE ROAD, SUITE 400, WILMINGTON, DELAWARE, 19808
Covered Properties (19)
Bond Pad Structure and Its Method of Fabricating
Patent: 6,365,970 →
Application: 09/458,778 →
Multi-Layered Substrate with a Built-in Capacitor Design
Patent: 6,395,996 →
Application: 09/571,242 →
Apparatus for Reducing an Electrical Noise Inside a Ball Grid Array Package
Patent: 6,509,646 →
Application: 09/575,637 →
Esd Protection Circuit for Mixed-Voltage I/O by Using Stacked Nmos Transistors with Substrate Triggering Technique
Patent: 6,657,835 →
Application: 09/874,996 →
Publication: US 2002/0159208
Multi-Layered Substrate with a Built-in Capacitor Design and a Method of Making the Same
Patent: 6,653,574 →
Application: 09/935,913 →
Publication: US 2002/0054467
Bond Pad Structure and Its Method of Fabricating
Patent: 6,524,942 →
Application: 10/056,004 →
Publication: US 2002/0064932
Substrate for Semiconductor Package
Patent: 6,933,600 →
Application: 10/152,191 →
Publication: US 2003/0160294
Integrated Circuit Bonding Device and Manufacturing Method Thereof
Patent: 6,765,301 →
Application: 10/212,106 →
Publication: US 2003/0094703
Electrostatic Discharge Protection Device for Giga-Hertz Radio Frequency Integrated Circuits with Varactor-Lc Tanks
Patent: 6,885,534 →
Application: 10/277,640 →
Publication: US 2004/0075964
Esd Protection Circuit with Self-Triggered Technique
Patent: 6,744,107 →
Application: 10/325,892 →
Chip-Packaging Substrate and Test Method Therefor
Patent: 6,707,677 →
Application: 10/385,681 →
Flip Chip Package Structure
Patent: 6,747,350 →
Application: 10/455,525 →
Method of Manufacturing an Esd Protection Device with the Same Mask for Both Ldd and Esd Implantation
Patent: 7,049,659 →
Application: 10/658,772 →
Publication: US 2005/0051848
Heat Dissipation Mechanism for Electronic Apparatus
Patent: 7,307,844 →
Application: 11/056,533 →
Publication: US 2005/0111195
Method of manufacturing an ESD protection device with the same mask for both LDD and ESD implantation
Application: 11/240,475 →
Publication: US 2006/0027873
Esd Protection Circuit
Patent: 7,397,642 →
Application: 11/280,215 →
Publication: US 2007/0030610
Method of Manufacturing an Esd Protection Device with the Same Mask for Both Ldd and Esd Implantation
Patent: 7,288,449 →
Application: 11/286,406 →
Publication: US 2006/0081927
Instruction Folding Mechanism, Method for Performing the Same and Pixel Processing System Employing the Same
Patent: 7,502,029 →
Application: 11/333,479 →
Publication: US 2007/0165028
Instruction Folding Mechanism, Method for Performing the Same and Pixel Processing System Employing the Same
Patent: 8,520,016 →
Application: 12/400,127 →
Publication: US 2010/0177096
Related Assignments (20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 6, 2003
From: LIN, WEI-FENG; HSUEH, YIN-CHIEH; WU, CHUNG-JU
To: SILICON INTEGRATED SYSTEMS CORP.
Reel/Frame 014153/0853 →
Assignment of Assignor's Interest Sep 10, 2003
From: KER, MING-DOU; HSU, HSIN-CHYH; LO, WEN-YU
To: SILICON INTEGRATED SYSTEMS CORP.
Reel/Frame 014477/0009 →
Assignment of Assignor's Interest Mar 4, 2005
From: WU, CHUNG-JU
To: SILICON INTEGRATED SYSTEMS CORP.
Reel/Frame 015734/0730 →
Assignment of Assignor's Interest Nov 17, 2005
From: KER, MING-DOU; LEE, CHIEN-MING
To: SILICON INTEGRATED SYSTEMS CORP.
Reel/Frame 017352/0492 →
Assignment of Assignor's Interest Jan 17, 2006
From: HSU, R-MING
To: SILICON INTEGRATED SYSTEMS CORP.
Reel/Frame 017483/0092 →
Assignment of Assignor's Interest May 4, 2009
From: WU, CHUNG JU; LIANG, KUEI CHEN; LIN, WEI FENG
To: SILICON INTEGRATED SYSTEMS CORP.
Reel/Frame 022634/0116 →
Assignment of Assignor's Interest May 5, 2009
From: HSU, R-MING
To: SILICON INTEGRATED SYSTEMS CORP.
Reel/Frame 022634/0750 →
Assignment of Assignor's Interest Mar 21, 2019
From: INTELLECTUAL VENTURES ASSETS 108 LLC
To: M-RED INC.
Reel/Frame 048662/0318 →
Assignment of Assignor's Interest Mar 22, 2019
From: TAICHI HOLDINGS, LLC
To: INTELLECTUAL VENTURES ASSETS 108 LLC
Reel/Frame 048680/0946 →
Nunc Pro Tunc Assignment May 14, 2019
From: TAICHI HOLDINGS, LLC
To: INTELLECTUAL VENTURES ASSETS 124 LLC
Reel/Frame 049167/0558 →
Assignment of Assignor's Interest May 23, 2019
From: INTELLECTUAL VENTURES ASSETS
To: SAMSUNG ELECTRONCS CO., LTD.
Reel/Frame 049266/0532 →
Assignment of Assignor's Interest Jan 3, 2020
From: TAICHI HOLDINGS, LLC
To: INTELLECTUAL VENTURES ASSETS 154 LLC
Reel/Frame 051412/0949 →
Assignment of Assignor's Interest Jan 27, 2020
From: INTELLECTUAL VENTURES ASSETS 154 LLC
To: LIBERTY PATENTS LLC
Reel/Frame 051709/0805 →
Assignment of Assignor's Interest Jul 1, 2022
From: INTELLECTUAL VENTURES ASSETS 174 LLC
To: INTELLECTUAL VENTURES 178 LLC
Reel/Frame 060571/0948 →
Assignment of Assignor's Interest Jul 1, 2022
From: TAICHI HOLDINGS, LLC
To: INTELLECTUAL VENTURES ASSETS 174 LLC
Reel/Frame 060571/0939 →
Corrective Assignment to Correct the the Assignee's Name Previously Recorded at Reel: 060571 Frame: 0948. Assignor(S) Hereby Confirms the Assignment. Jul 22, 2022
From: INTELLECTUAL VENTURES ASSETS 174 LLC
To: INTELLECTUAL VENTURES ASSETS 178 LLC
Reel/Frame 060819/0006 →
Assignment of Assignor's Interest Feb 12, 2023
From: TAICHI HOLDINGS, LLC
To: INTELLECTUAL VENTURES ASSETS 186 LLC
Reel/Frame 062667/0597 →
Security Interest Mar 24, 2023
From: MIND FUSION, LLC
To: INTELLECTUAL VENTURES ASSETS 191 LLC; INTELLECTUAL VENTURES ASSETS 186 LLC
Reel/Frame 063295/0001 →
Patent Security Agreement May 1, 2023
From: RPX CORPORATION
To: BARINGS FINANCE LLC, AS COLLATERAL AGENT
Reel/Frame 063503/0742 →
Assignment of Assignor's Interest Jul 13, 2023
From: INTELLECTUAL VENTURES ASSETS 186 LLC
To: MIND FUSION, LLC
Reel/Frame 064271/0001 →