Patent Assignment
Reel/Frame 014153/0853
Assignment of Assignor's Interest
Recorded: 2003-06-06
Pages: 2
Assignors
LIN, WEI-FENG
Executed: 2003-05-19
HSUEH, YIN-CHIEH
Executed: 2003-05-19
WU, CHUNG-JU
Executed: 2003-05-19
Assignee
SILICON INTEGRATED SYSTEMS CORP.
NO. 16, CREATION RD. 1, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU R.O.C., TAIWAN
Covered Property
(1)
Flip Chip Package Structure
Patent:
6,747,350 →
Application:
10/455,525 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 8, 2009
From: SILICON INTEGRATED SYSTEMS CORP.
To: TAICHI HOLDINGS, LLC
Reel/Frame 023348/0301 →
Assignment of Assignor's Interest
Jul 1, 2022
From: TAICHI HOLDINGS, LLC
To: INTELLECTUAL VENTURES ASSETS 174 LLC
Reel/Frame 060571/0939 →
Assignment of Assignor's Interest
Jul 1, 2022
From: INTELLECTUAL VENTURES ASSETS 174 LLC
To: INTELLECTUAL VENTURES 178 LLC
Reel/Frame 060571/0948 →
Corrective Assignment to Correct the the Assignee's Name Previously Recorded at Reel: 060571 Frame: 0948. Assignor(S) Hereby Confirms the Assignment.
Jul 22, 2022
From: INTELLECTUAL VENTURES ASSETS 174 LLC
To: INTELLECTUAL VENTURES ASSETS 178 LLC
Reel/Frame 060819/0006 →