Granted Patent
Utility
US 6,747,350 · App. 10/455,525
Flip chip package structure
Inventors:
Wei-Feng Lin, Yin-Chieh Hsueh, Chung-Ju Wu
Patented Case
View Patent ↗
Granted: Jun 8, 2004
Filed: Jun 6, 2003
Inventors
Wei-Feng Lin
Yin-Chieh Hsueh
Chung-Ju Wu
Assignee (at issue)
Silicon Integrated Systems Corp.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.