Patent Assignment
Reel/Frame 049266/0532
Assignment of Assignor's Interest
Recorded: 2019-05-23
Pages: 7
Assignor
INTELLECTUAL VENTURES ASSETS
Executed: 2019-04-30
Assignee
SAMSUNG ELECTRONCS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO,, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Properties
(27)
Multi-Port System and Method for Routing a Data Element Within an Interconnection Fabric
Multiple Data Path Memories and Systems
Interconnection Fabric Enumeration
Multi-Port System and Method for Routing a Data Element Within an Interconnection Fabric
Multi-Port System and Method for Routing a Data Element Within an Interconnection Fabric
Instruction Folding Mechanism, Method for Performing the Same and Pixel Processing System Employing the Same
Semiconductor Device Having Variable Parameter Selection Based on Temperature and Test Method
Patent:
7,383,149 →
Application:
11/637,280 →
Semiconductor Device Having Variable Parameter Selection Based on Temperature and Test Method
Patent:
8,049,145 →
Application:
11/708,174 →
Semiconductor Device Having Variable Parameter Selection Based on Temperature and Test Method
Patent:
7,603,249 →
Application:
11/708,184 →
Semiconductor Device Having Variable Parameter Selection Based on Temperature and Test Method
Patent:
7,535,786 →
Application:
11/708,185 →
Semiconductor Device Having Variable Parameter Selection Based on Temperature and Test Method
Patent:
7,480,588 →
Application:
11/708,408 →
Semiconductor Device Having Variable Parameter Selection Based on Temperature and Test Method
Patent:
7,760,570 →
Application:
11/708,733 →
Semiconductor Device Having Variable Parameter Selection Based on Temperature and Test Method
Patent:
7,720,627 →
Application:
12/150,091 →
Semiconductor Device Having Variable Parameter Selection Based on Temperature and Test Method
Patent:
7,654,736 →
Application:
12/315,521 →
Semiconductor Device Having Variable Parameter Selection Based on Temperature and Test Method
Patent:
7,639,548 →
Application:
12/391,764 →
Instruction Folding Mechanism, Method for Performing the Same and Pixel Processing System Employing the Same
Temperature Sensing Circuit with Hysteresis and Time Delay
Semiconductor Device Having Variable Parameter Selection Based on Temperature and Test Method
Multi-Port System and Method for Routing a Data Element Within an Interconnection Fabric
Semiconductor Device Having Variable Parameter Selection Based on Temperature and Test Method
Semiconductor Device Having Variable Parameter Selection Based on Temperature and Test Method
Semiconductor Device Having Variable Parameter Selection Based on Temperature and Test Method
Multi-Port System and Method for Routing a Data Element Within an Interconnection Fabric
Semiconductor Device Having Variable Parameter Selection Based on Temperature
Semiconductor Device Having Variable Parameter Selection Based on Temperature and Test Method
Multi-Port System and Method for Routing a Data Element Within an Interconnection Fabric
Semiconductor Device Having Variable Parameter Selection Based on Temperature and Test Method
Related Assignments
(11)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 19, 2010
From: BROCCO, LYNNE M.; COMINS, TODD R.; DOHM, NATHAN J.; MAYHEW, DAVID E.
To: STARGEN TECHNOLOGIES, INC.
Reel/Frame 023809/0940 →
Assignment of Assignor's Interest
Jan 19, 2010
From: DOLPHIN INTERCONNECT SOLUTIONS ASA
To: JINSALAS SOLUTIONS, LLC
Reel/Frame 023811/0046 →
Assignment of Assignor's Interest
Jan 19, 2010
From: DOLPHIN INTERCONNECT SOLUTIONS NORTH AMERICA INC.
To: DOLPHIN INTERCONNECT SOLUTIONS ASA
Reel/Frame 023811/0033 →
Assignment of Assignor's Interest
Jan 19, 2010
From: STARGEN, INC.
To: DOLPHIN INTERCONNECT SOLUTIONS NORTH AMERICA INC.
Reel/Frame 023811/0027 →
Corrective Assignment to Correct the Clerical Error in Assignee Name Previously Recorded on Reel 013536 Frame 0628. Assignor(S) Hereby Confirms the Assignee Name as Stargen, Inc..
Jan 19, 2010
From: BROCCO, LYNNE M.; COMINS, TODD R.; DOHM, NATHAN J.; MAYHEW, DAVID E.
To: STARGEN, INC.
Reel/Frame 023811/0018 →
Merger
Dec 31, 2015
From: INTELLECTUAL VENTURES HOLDING 83 LLC
To: NYTELL SOFTWARE LLC
Reel/Frame 037391/0741 →
Merger
Jan 12, 2016
From: JINSALAS SOLUTIONS, LLC
To: CALLAHAN CELLULAR L.L.C.
Reel/Frame 037487/0249 →
Assignment of Assignor's Interest
May 14, 2019
From: S. AQUA SEMICONDUCTOR, LLC
To: INTELLECTUAL VENTURES ASSETS 129 LLC
Reel/Frame 049167/0177 →
Nunc Pro Tunc Assignment
May 14, 2019
From: TAICHI HOLDINGS, LLC
To: INTELLECTUAL VENTURES ASSETS 124 LLC
Reel/Frame 049167/0558 →
Assignment of Assignor's Interest
May 14, 2019
From: CALLAHAN CELLULAR L.L.C.
To: INTELLECTUAL VENTURES ASSETS 124 LLC
Reel/Frame 049167/0403 →
Assignment of Assignor's Interest
May 14, 2019
From: NYTELL SOFTWARE LLC
To: INTELLECTUAL VENTURES ASSETS 124 LLC
Reel/Frame 049167/0319 →