Semiconductor device having variable parameter selection based on temperature and test method
View Patent ↗A semiconductor device that may include temperature sensing circuits is disclosed. The temperature sensing circuits may be used to control various parameters, such as internal regulated supply voltages, internal refresh frequency, a word line low voltage, or the like. In this way, operating specifications of a semiconductor device at worst case temperatures may be met without compromising performance at normal operating temperatures. Each temperature sensing circuit may include a selectable temperature threshold value as well as a selectable temperature hysteresis value. In this way, temperature performance characteristics may be finely tuned. Furthermore, a method of testing the temperature sensing circuits is disclosed in which a current value may be monitored and temperature threshold values and temperature hysteresis values may be thereby determined.
1. A method of testing a temperature sensing circuit in a semiconductor device, comprising the steps of:
providing a temperature to the semiconductor device;
performing a first current measurement of the semiconductor device;
incrementing the temperature of the semiconductor device; and
performing a second current measurement of the semiconductor device;
wherein a step increase in current from the first current to the second current indicates a temperature indication signal provided by the temperature sensing circuit has changed from a first state to a second state.
2. The method of testing the temperature sensing circuit in the semiconductor device of claim 1 , further includes the steps of:
performing a third current measurement of the semiconductor device;
decrementing the temperature of the semiconductor device; and
performing a fourth current measurement of the semiconductor device;
a step decrease in current from the third current measurement of to the fourth current indicates the temperature indication signal provided by the temperature sensing circuit has changed from the second state to the first state.
3. The method of testing a temperature sensing circuit in the semiconductor device of claim 1 , wherein:
the semiconductor device is a semiconductor memory device.
4. The method of testing the temperature sensing circuit in the semiconductor device of claim 1 , wherein:
the semiconductor device is a dynamic random access memory.
5. The method of testing the temperature sensing circuit in the semiconductor device of claim 4 , further including the step of:
placing the semiconductor device in a mode of operation.
6. The method of testing the temperature sensing circuit in the semiconductor device of claim 5 , wherein:
the mode of operation is a self-refresh mode.
7. A method of testing a temperature sensing circuit in a semiconductor device, comprising the steps of:
providing a temperature to the semiconductor device;
performing a first current measurement of the semiconductor device;
changing the temperature of the semiconductor device in a first direction; and
performing a second current measurement of the semiconductor device;
wherein a step change in current from the first current to the second current indicates a temperature indication signal provided by the temperature sensing circuit has changed from a first state to a second state.
8. The method of testing the temperature sensing circuit in the semiconductor device of claim 7 , further including the step of:
placing the semiconductor device in a mode of operation.
9. The method of testing a temperature sensing circuit in the semiconductor device of claim 8 , further including the steps of:
performing a third current measurement of the semiconductor device;
changing the temperature of the semiconductor device in an opposite direction; and
performing a fourth current measurement of the semiconductor device;
a step change in current from the third current measurement of to the fourth current a temperature indication signal provided by the temperature sensing circuit has changed from the second state to the first state.
10. The method of testing the temperature sensing circuit in the semiconductor device of claim 7 , wherein:
the semiconductor device is a semiconductor memory device.
11. The method of testing the temperature sensing circuit in the semiconductor device of claim 7 , wherein:
the semiconductor device is a dynamic random access memory.
12. A method of testing a temperature sensing circuit in a semiconductor device, comprising the steps of:
changing the temperature of the semiconductor device; and
monitoring an operating parameter of the semiconductor device
wherein the operating parameter is monitored for a step change to indicate a temperature indication signal provided by the temperature sensing circuit has changed from a first state to a second state wherein
the test is performed while the semiconductor device is integrally contained on a silicon wafer with a plurality of like semiconductor devices.
13. The method of testing the temperature sensing circuit in the semiconductor device of claim 12 , wherein the operating parameter is a current value.
14. The method of testing the temperature sensing circuit in the semiconductor device of claim 12 , wherein:
the step of changing the temperature of the semiconductor device includes decrementing the temperature.
15. The method of testing the temperature sensing circuit in the semiconductor device of claim 12 , wherein:
the semiconductor device is a memory device.
16. The method of testing the temperature sensing circuit in the semiconductor device of claim 12 , wherein:
the semiconductor device is a dynamic random access memory device.
17. The method of testing the temperature sensing circuit in the semiconductor device of claim 16 , wherein:
the operating parameter is a current value.
18. The semiconductor device of claim 16 , wherein:
the operating parameter is an average current value.