Diffusion barrier layer and method for manufacturing a diffusion barrier layer
View Patent ↗A diffusion barrier system for a display device comprising a layer system with at least two layers of dielectric material, wherein at least two adjacent layers of that layer system comprise the same material. A respective method for manufacturing such a diffusion barrier system in a single process chamber of a plasma deposition system has the steps of introducing a substrate to be treated in said process chamber, discretely varying in a controlled manner during deposition at least one process parameter in the process chamber, without completely interrupting such process parameter, which results in layers with different properties and finally unloading said substrate from said process.
1. A diffusion barrier or encapsulation layer system comprising an inorganic layer system of dielectric material, with at least two adjacent layers of that inorganic layer system comprising the same material, said dielectric material being one of a nitride, oxide, carbide and oxynitride and combinations thereof of a metal or a semiconductor, wherein said inorganic layer system comprises at least four layers exhibiting a water vapor transition rate of or less than 5.66×10 −4 g/m 2 /day at 20° C. and 50% humidity.
2. Diffusion barrier or encapsulation layer system according to claim 1 , wherein the metal is one of Al, Cr, Cu, Ge, In, Ir Sb, Sn, Ta, Ti, Zr or combinations thereof.
3. Diffusion barrier or encapsulation layer system according to claim 1 , wherein the dielectric material comprises silicon nitride or silicon oxynitride (SiO x N y ).
4. Diffusion barrier or encapsulation layer system according to claim 1 wherein each layer in said system has a layer thickness is in the range of 15-100 nm.
5. Display device comprising a substrate chosen from the group of glass, metal, polymer or paper with a diffusion barrier system according to claim 1 .
6. Display device according to claim 5 , further comprising a organic light emitting diode layer.