NANO IC packaging

1. A package for integrated circuit, comprising

a chip having a plurality of chip pads adapted to receive the variety of signals from or to output the same to an external circuit;

a lead frame having a plurality of contact points each corresponding to a chip pad; and

bonding wires electrically connecting the chip pads and the respective contact points on the lead frame, wherein each bonding wire comprises a nano material.

2. The package of claim 1 , wherein the nano material comprises one or more of Fullerene molecules, nanotubes, nanowires, nanocomposites, nanostructured carbon material.

3. The package of claim 2 , wherein the bonding wires are formed by self-assembling the nano material.

4. The package of claim 3 , wherein the self-assembly of the nano material includes one or more functionally-specific agents.

5. The package of claim 4 , wherein the bonding wires comprise metallic element in combination with the one or more functionally-specific agents wherein the metallic element include one or more of palladium (Pd), rhodium (Rh), platinum (Pt), and iridium (Ir), boron (B), beryllium (Be), and calcium (Ca), phosphorous (P), antimony (Sb), and bismuth (Bi), magnesium (Mg), thallium (TI), zinc (Zn), and tin (Sn).

6. The package of claim 1 , wherein the bonding wire function as an antenna.

7. The package of claim 5 , wherein the bonding wire is formed by nanotubes or nanowires.

8. The package of claim 6 , wherein the electric length of the antenna is varied by controlling the length of the nanotube or the nanowire.

9. The package of claim 6 , wherein the diameter of the antenna is varied by combining an optimum number of strands of the nanotubes or the nanowires.

10. The package of claim 5 , wherein the chip is a transceiver for wireless signals.

11. The package of claim 1 , further comprising

nano ceramic material in thermal communication with the chip for removing heat from the chip.

12. The package of claim 1 , further comprising a nano-thermoelectric cooler to keep package temperature within a predetermined range.

13. A package for integrated circuit, comprising

a chip having a plurality of chip pads adapted to receive the variety of signals from or to output the same to an external circuit;

a lead frame having a plurality of contact points each corresponding to a chip pad; and

nano ceramic material in thermal communication with the chip for removing heat from the chip.

14. The package of claim 13 , comprising bonding wires electrically connecting the chip pads and the respective contact points on the lead frame, wherein each bonding wire comprises a nano material.

15. The package of claim 13 , wherein the chip comprises a hybrid electronic device, comprising:

a substrate;

a first layer fabricated using semiconductor fabrication techniques;

a second layer formed above the first layer, the second layer having one or more NANO-bonding areas;

one or more NANO-elements self-assembled to the second layer molecular bonding areas.

16. The package of claim 15 , wherein the NANO-elements is disposed in an array pattern.

17. The package of claim 13 , wherein the bonding wires comprise metallic element in combination with the one or more functionally-specific agents wherein the metallic element include one or more of palladium (Pd), rhodium (Rh), platinum (Pt), and iridium (Ir), boron (B), beryllium (Be), and calcium (Ca), phosphorous (P), antimony (Sb), and bismuth (Bi), magnesium (Mg), thallium (TI), zinc (Zn), and tin (Sn).

18. The package of claim 13 , comprising bonding wires that function as an antenna.

19. The package of claim 13 , comprising bonding wires formed by nanotubes or nanowires.

20. The method of claim 13 , comprising a nano-thermoelectric cooler to keep a package temperature within a predetermined range.