Substrates adapted for adhesive bonding
View Patent ↗A first substrate suitable for bonding to a second substrate using an adhesive is provided. The first substrate has a plurality of etched trenches defined in a first bonding surface. The etched trenches are configured for receiving the adhesive during bonding, thereby increasing the adhesive bond strength. The first substrates are exemplified by semiconductor chips.
1. A first substrate suitable for bonding to a second substrate using an adhesive, said first substrate having a plurality of etched trenches defined in a first bonding surface, the etched trenches being configured for receiving the adhesive during bonding, wherein the etched trenches increase the effective surface area of the first bonding surface by at least 20%.
2. The first substrate of claim 1 , having a thickness of less than 1000 microns.
3. The first substrate of claim 1 , having a thickness of less than 250 microns.
4. The first substrate of claim 1 , which is a semiconductor integrated circuit.
5. The first substrate of claim 1 , which is a MEMS integrated circuit.
6. The first substrate of claim 1 , which is a printhead integrated circuit.
7. The first substrate of claim 1 , wherein the etched trenches have a diameter or a width sufficient to draw in a liquid adhesive by capillary action.
8. The first substrate of claim 1 , wherein the etched trenches have a diameter or a width of less than about 10 microns.
9. The first substrate of claim 1 , wherein the etched trenches have a depth of at least 20 microns.
10. The first substrate of claim 1 , wherein the etched trenches have an aspect ratio of at least 3:1.
11. The first substrate of claim 1 , wherein the first bonding surface has a maximum surface roughness R max of less than about 20 nm.
12. The first substrate of claim 1 , wherein the first bonding surface has a maximum surface roughness R max of less than about 5 nm.
13. The first substrate of claim 1 , wherein the first bonding surface has an average surface roughness R a of less than about 20 nm.
14. The first substrate of claim 1 , wherein the first bonding surface has an average surface roughness R a of less than about 5 nm.
15. The first substrate of claim 1 , wherein the first substrate has a Total Thickness Variation (TTV) of less than about 5 microns.
16. The first substrate of claim 1 , wherein the adhesive is a liquid-based adhesive.
17. The first substrate of claim 1 , wherein the adhesive is an adhesive tape comprising a liquid-based adhesive.