Patent Assignment
Reel/Frame 032274/0397
Assignment of Assignor's Interest
Recorded: 2014-02-18
Pages: 10
Assignor
SILVERBROOK RESEARCH PTY. LIMITED
Executed: 2012-05-03
Assignee
ZAMTEC LIMITED
8 FITZWILLIAM SQUARE, DUBLIN 2, IRELAND
Covered Properties
(47)
Utilisation of Quantum Wires in Mems Actuators
Patent:
6,041,600 →
Application:
09/113,064 →
Method of Tab Alignment in an Integrated Circuit Type Device
Patent:
6,382,769 →
Application:
09/113,075 →
Micro Cillia Array and Use Thereof
Patent:
6,044,646 →
Application:
09/113,079 →
A Micro-Electro Mechanical System
Patent:
6,286,935 →
Application:
09/113,080 →
Utilising Venting in a Mems Liquid Pumping System
Patent:
6,340,222 →
Application:
09/113,093 →
Corrugated Mems Heater Structure
Patent:
6,087,638 →
Application:
09/113,100 →
Printhead Ink Supply System
Patent:
6,293,658 →
Application:
09/113,105 →
Print Media Cartridge with Integral Print Media Transport Mechanism
Patent:
6,626,529 →
Application:
09/436,508 →
Pc Card Printer
Patent:
6,158,907 →
Application:
09/436,509 →
Printer Unit for Pc Disk Drive Bay
Patent:
6,270,177 →
Application:
09/436,533 →
Method of Fabricating Devices Incorporating Microelectromechanical Systems Using Uv Curable Tapes
Patent:
6,425,971 →
Application:
09/567,951 →
Micro-mechanical device comprising a liquid chamber
Patent:
6,315,399 →
Application:
09/575,142 →
Calibrating a micro electro-mechanical device
Patent:
6,322,194 →
Application:
09/575,151 →
Method of Fabricating Devices Incorporating Microelectromechanical Systems Using at Least One Uv Curable Tape
Patent:
6,383,833 →
Application:
09/575,158 →
Testing a micro electro- mechanical device
Patent:
6,382,779 →
Application:
09/575,177 →
Method of Fabricating Devices Incorporating Microelectromechanicl Systems Using Uv Curable Tapes
Method of Fabricating Devices Incorporating Microelectromechanical Systems Using at Least One Uv Curable Tape
Patent:
7,063,993 →
Application:
10/296,660 →
Method of Fabricating Mems Devices on a Silicon Wafer
Printhead Assembly Having Improved Adhesive Bond Strength
Bonded Assembly Having Improved Adhesive Bond Strength
Substrates Adapted for Adhesive Bonding
Method of Bonding Substrates
Printhead Integrated Circuit Adapted for Adhesive Bonding
Method of Separating Mems Devices from a Composite Structure
Electronic Device Having Improved Security
Sheet Feed Mechanism
System for Protecting Sensitive Data from User Code in Register Window Architecture
Method of Bonding Mems Integrated Circuits
Method for Testing Alignment of a Test Bed with a Plurality of Integrated Circuits Thereon
Application:
12/193,716 →
Publication:
US 2010/0045729
Measuring Apparatus for Performing Positional Analysis on an Integrated Circuit Carrier
Imaging Apparatus for Imaging Integrated Circuits on an Integrated Circuit Carrier
Apparatus for Testing Integrated Circuitry
Method for Assembling a Carrier for Integrated Circuits
Carriage Assembly for an Assembling Apparatus
Application:
12/193,739 →
Publication:
US 2010/0044527
Adhesive Application Apparatus for Use with an Assembling Machine
Wafer Positioning System
Placement Head for a Die Placing Assembly
Method of Forming Assymetrical Encapsulant Bead
Tack Adhesion Testing Device
Sheet Feed Mechanism
Method of Removing Photoresist and Etch-Residues from Vias
Application:
12/546,681 →
Publication:
US 2011/0049091
Method of Bonding Selected Integrated Circuit to Adhesive Substrate
System for Protecting Supervisor Mode Data from User Code
Sheet Feed Mechanism
Pressure Tester for Printhead Integrated Circuit Carrier
Printed Circuit Board Bonding Device
Application:
13/220,630 →
Publication:
US 2012/0006494
Method of Mounting Mems Integrated Circuits Directly from Wafer Film Frame
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 3, 2014
From: GOOGLE INC.
To: SILVERBROOK RESEARCH PTY LTD.
Reel/Frame 032599/0555 →
Change of Name
Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →
Change of Name
Dec 21, 2016
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 041113/0557 →