Method of bonding selected integrated circuit to adhesive substrate
View Patent ↗A method of bonding an integrated circuit to an adhesive substrate. The integrated circuit is one of a plurality of integrated circuits, each having a respective frontside releasably attached to a film frame tape supported by a wafer film frame. The method includes the steps of: (a) selecting one of the integrated circuits for bonding to the adhesive substrate; (b) positioning the adhesive substrate at a backside of the selected integrated circuit; (c) positioning a bonding tool on a zone of the film frame tape, the zone being aligned with the selected integrated circuit; and (d) applying a bonding force from the bonding tool through the film frame tape and the selected integrated circuit onto the adhesive substrate, so as to bond the backside of the selected integrated circuit to the substrate.
1. A method of bonding an integrated circuit to an adhesive substrate, said integrated circuit being one of a plurality of integrated circuits each having a respective frontside releasably attached to a film frame tape supported by a wafer film frame, said method comprising the steps of:
(a) selecting one of said integrated circuits for bonding to said adhesive substrate;
(b) positioning the adhesive substrate at a backside of said selected integrated circuit;
(c) positioning a bonding tool on a zone of said film frame tape, said zone being aligned with said selected integrated circuit; and
(d) applying a bonding force from said bonding tool through said film frame tape and said selected integrated circuit onto said adhesive substrate, thereby bonding said backside of said selected integrated circuit to said substrate,
wherein a backside oxide layer of each of said integrated circuits is pre-treated with liquid ammonia prior to bonding.
2. The method of claim 1 , further comprising the step of:
removing said bonding tool from said tape.
3. The method of claim 1 , wherein said film frame tape is a UV-release tape.
4. The method of claim 2 , further comprising the step of:
exposing said zone of said film frame tape to UV radiation and releasing the bonded integrated circuit from said tape.
5. The method of claim 1 , wherein said integrated circuit is a MEMS integrated circuit.
6. The method of claim 1 , wherein said integrated circuit is a printhead integrated circuit.
7. The method of claim 6 , wherein steps (a) to (c) are repeated so as to construct a printhead on said adhesive substrate, said printhead comprising a plurality of abutting printhead integrated circuits.
8. The method of claim 6 , wherein said substrate has a plurality of ink supply holes defined therein, wherein one or more of said holes are aligned with ink supply channels defined in the backside of said printhead integrated circuit.
9. The method of claim 1 , wherein said adhesive substrate is an intermediary substrate for attachment of said printhead integrated circuit to an ink supply manifold.
10. The method of claim 9 , wherein said intermediary substrate is an adhesive polymer film.
11. The method of claim 9 , wherein said intermediary substrate is a rigid member having a coefficient of thermal expansion within about 20% of the coefficient of thermal expansion of the printhead integrated circuit and/or the ink supply manifold.
12. The method of claim 9 , wherein said intermediary substrate is a glass member.