Adhesive application apparatus for use with an assembling machine
View Patent ↗The invention relates to an adhesive application apparatus for use with an assembling machine for assembling operatively upper and lower components for carrying printhead integrated circuits. The application apparatus includes a plate and a dispensing mechanism which includes an adhesive reservoir, said mechanism being operatively engaged with said plate in a sealing and sliding manner, the mechanism configured to dispense adhesive onto the plate when sliding along the plate. The apparatus also includes a displacement mechanism to slide the dispensing mechanism along the plate, and a control system to control operation of the dispensing and displacement mechanisms.
1. An adhesive application apparatus for use with an assembling machine for assembling upper and lower components of a carrier for carrying printhead integrated circuits, the application apparatus comprising:
a plate for receiving thereon an adhesive;
a dispensing mechanism having an adhesive reservoir in contact with the plate, the adhesive reservoir being magnetically attracted to the plate to form a tight seal therewith and adapted to slide across the plate to dispense adhesive thereon;
a displacement mechanism to slide the adhesive reservoir along the plate; and
a control system to control operation of the dispensing and displacement mechanisms, wherein
the adhesive reservoir further includes a sealing member in contact with the plate, the sealing member for reducing a surface friction between the adhesive reservoir and the plate.
2. An adhesive application apparatus as claimed in claim 1 , wherein the dispensing mechanism is configured to dispense adhesive according to a pad printing technique.
3. An adhesive application apparatus as claimed in claim 1 , wherein the plate defines an etched channel shaped and dimensioned according to the upper component, so that a particular part of the upper component is covered in adhesive when the portion is placed on the plate.
4. An adhesive application apparatus as claimed in claim 1 , wherein the displacement mechanism includes a linear carriage and actuator engaged with the dispensing mechanism.
5. An adhesive application apparatus as claimed in claim 1 , wherein the adhesive reservoir is a glue cup.