Printhead integrated circuit adapted for adhesive bonding
View Patent ↗A printhead integrated circuit suitable for bonding to a mounting surface of an ink manifold using an adhesive is provided. The printhead integrated circuit comprises: a plurality of nozzles formed on a front side of the printhead integrated circuit; a plurality of ink supply channels for supplying ink from a backside of the printhead integrated circuit to the nozzles; and a plurality of etched trenches defined in the backside. The etched trenches are configured for receiving the adhesive during bonding, thereby increasing the adhesive bond strength.
1. A printhead integrated circuit suitable for bonding to a mounting surface of an ink manifold using an adhesive, said printhead integrated circuit comprising:
a plurality of nozzles formed on a front side of the printhead integrated circuit;
a plurality of ink supply channels for supplying ink from a backside of the printhead integrated circuit to the nozzles; and
a plurality of etched trenches defined in the backside, the etched trenches being configured for receiving the adhesive during bonding,
wherein said printhead integrated circuit has a thickness of less than 250 microns.
2. The printhead integrated circuit of claim 1 , wherein the etched trenches have a diameter or a width sufficient to draw in a liquid adhesive by capillary action.
3. The printhead integrated circuit of claim 1 , wherein the etched trenches have a diameter or a width of less than about 10 microns.
4. The printhead integrated circuit of claim 1 , wherein the etched trenches have a depth of at least 20 microns.
5. The printhead integrated circuit of claim 1 , wherein the etched trenches have an aspect ratio of at least 3:1.
6. The printhead integrated circuit of claim 1 , wherein the etched trenches increase the effective surface area of the first bonding surface by at least 20%.
7. The printhead integrated circuit of claim 1 , wherein the first bonding surface has a maximum surface roughness R max of less than about 20 nm.
8. The printhead integrated circuit of claim 1 , wherein the first bonding surface has a maximum surface roughness R max of less than about 5 nm.
9. The printhead integrated circuit of claim 1 , wherein the first bonding surface has an average surface roughness R a of less than about 20 nm.
10. The printhead integrated circuit of claim 1 , wherein the first bonding surface has an average surface roughness R a of less than about 5 nm.
11. The printhead integrated circuit of claim 1 , having a Total Thickness Variation (TTV) of less than about 5 microns.
12. The printhead integrated circuit of claim 1 , wherein the adhesive is a liquid-based adhesive.
13. The printhead integrated circuit of claim 1 , wherein the adhesive is an adhesive tape comprising a liquid-based adhesive.