IP Library Granted Patent US 7,804,993
Granted Patent B2
US 7,804,993 · App. 11/068,711 · Granted Sep 28, 2010

Method and apparatus for detecting defects in wafers including alignment of the wafer images so as to induce the same smear in all images

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Quick Facts
Patent No.
US 7,804,993
App. No.
11/068,711
Granted
Sep 28, 2010
Kind
B2
Abstract

A method for inspecting a wafer including a multiplicity of dies, the method including dividing an image of at least a portion of the wafer into a plurality of sub-images each representing a sub-portion of the wafer and selecting at least one defect candidate within each sub-image by comparing each sub-image to a corresponding sub-image of a reference including a representation, which is assumed to be faultless, of the portion of the wafer.

Claims (16)

1. A method for inspecting a wafer including a multiplicity of dies using an inspection apparatus, the method comprising:

aligning a plurality of images of purportedly identical portions of the wafer thereby to provide a plurality of mutually aligned images, said aligning including applying sub-pixel corrections to said images using a same-smear re-sampling filter which, for each respective one of the plurality of images, determines whether a respective image portion's misalignment (dx,dy) relative to a selected alignment marker is 0.5 pixel, and, if so, aligns the plurality of images with a (0.5,0.5) filter, and otherwise, aligns the plurality of images with a filter of order n>2 having a shift (dx,dy) and a frequency response that approximates a frequency response of said (0.5,0.5) filter, said plurality of mutually aligned images thereby having an essentially identical amount of smear.

2. A method according to claim 1 and also comprising:

combining said plurality of mutually aligned images having essentially identical amounts of smear into a reference; and

inspecting each of a further plurality of images of a corresponding plurality of portions of the wafer, relative to said reference.

3. A method according to claim 1 , wherein the re-sampling filter is characterized in that an amount of smear applied to an image is independent of a subpixel shift (dx,dy) applied to the image.

4. A method according to claim 1 , wherein the re-sampling filter is characterized in that an amount of smear applied to an image is independent of a subpixel component (dx,dy) of a shift performed on a portion of an image to be inspected in order to best align the portion with a corresponding portion of a reference image.

5. A system for inspecting a wafer including a multiplicity of dies, the system comprising:

an image aligner operative to align a plurality of images of purportedly identical portions of the wafer, thereby to provide a plurality of mutually aligned images, said image aligner including:

a sub-pixel corrector operative to apply sub-pixel corrections to said images using a same-smear re-sampling filter which, for each respective one of the plurality of images, determines whether a respective image portion's misalignment (dx,dy) relative to a selected alignment marker is 0.5 pixel, and, if so, aligns the plurality of images with a (0.5,0.5) filter, and otherwise, aligns the plurality of images with a filter of order n>2 having a shift (dx,dy) and a frequency response that approximates a frequency response of said (0.5,0.5) filter,

said plurality of mutually aligned images thereby having an essentially identical amount of smear.

6. A system according to claim 5 and also comprising:

an image combiner operative to combine said plurality of mutually aligned images having essentially identical amounts of smear into a reference; and

an image inspector operative to inspect each of a further plurality of images of a corresponding plurality of portions of the wafer, relative to said reference.

7. A system according to claim 5 , wherein the re-sampling filter is characterized in that an amount of smear applied to an image is independent of a subpixel shift (dx,dy) applied to the image.

8. A system according to claim 5 , wherein the re-sampling filter is characterized in that an amount of smear applied to an image is independent of a subpixel component (dx,dy) of a shift performed on a portion of an image to be inspected in order to best align the portion with a corresponding portion of a reference image.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 29, 2009
From: NEGEVTECH LTD.
To: APPLIED MATERIALS SOUTH EAST ASIA PTE. LTD.
Reel/Frame 022878/0815 →
SECURITY AGREEMENT Recorded Jun 19, 2008
From: NEGEVTECH LTD.
To: KREOS CAPITAL II LIMITED
Reel/Frame 021109/0971 →
SECURITY AGREEMENT Recorded Jun 19, 2008
From: NEGEVTECH LTD.
To: PLENUS II, L.P.; PLENUS II (D.C.M)
Reel/Frame 021118/0061 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 28, 2005
From: DORPHAN, YUVAL; WAGNER, MARK; SILBERSTEIN, SHAI; ZASLAVSKY, RAN; FURMAN, DOV
To: NEGEVTECH LTD.
Reel/Frame 016340/0013 →