Solid state image pickup device and manufacturing method thereof and semiconductor integrated circuit device and manufacturing method thereof
A method of manufacturing a solid-state image pickup device comprises a process for forming a plurality of photoelectric conversion elements PD within a semiconductor substrate 4 , a process for forming an interconnection portion, having an interconnection layer 8 in an insulating layer 7 , on the surface side of the semiconductor substrate 4 , a process for forming an adhesive layer, made of a material cured at a temperature lower than a deterioration starting temperature of the interconnection layer 8 , on the surface of the interconnection portion and bonding a supporting substrate 30 to the surface side of the interconnection portion through the adhesive layer 9 by heat treatment at a temperature lower than the deterioration starting temperature of the interconnection layer 8 and a process for decreasing a thickness of the semiconductor substrate 4 from the back side. A solid-state image pickup device manufacturing method can bond the supporting substrate 30 to the surface side of the interconnection portion through the adhesive layer 9 without exerting a thermal influence upon the interconnection layer 8 that was previously formed on the surface side of the semiconductor substrate 4.
1. A method of manufacturing a solid-state image pickup device comprising:
a process for forming a plurality of photoelectric conversion elements within a semiconductor substrate;
a process for forming an interconnection portion, having an interconnection layer in an insulating layer, on the surface side of said semiconductor substrate;
a process for forming an adhesive layer, made of a material cured at a temperature lower than a deterioration starting temperature of said interconnection layer, on the surface side of said interconnection portion and bonding a supporting substrate to said interconnection portion through said adhesive layer by heat treatment at a temperature lower than the deterioration starting temperature of said interconnection layer; and
a process for decreasing a thickness of said semiconductor substrate from the back side.
2. A method of manufacturing a solid-state image pickup device according to claim 1 , wherein said adhesive layer is formed of a coated film.
3. A method of manufacturing a solid-state image pickup device according to claim 1 , wherein said adhesive layer is formed by a CVD (chemical vapor deposition) method.
4. A method of manufacturing a solid-state image pickup device according to claim 1 , wherein said adhesive layer is silicified as a silicide layer by the heat treatment in the process for bonding said supporting substrate to said interconnection portion through said insulating layer after a metal film was deposited by a sputtering method.
5. A method of manufacturing a semiconductor integrated circuit device comprising:
a process for forming a circuit element on a semiconductor substrate;
a process for forming an interconnection portion, having an interconnection layer in an insulating layer, on the surface side of said semiconductor substrate; and
a process for forming an adhesive layer, made of a material cured at a temperature lower than a deterioration starting temperature of said interconnection layer, on the surface side of said interconnection portion and bonding a supporting substrate to said interconnection portion through said adhesive layer by heat treatment at a temperature lower than the deterioration starting temperature of said interconnection layer.
6. A method of manufacturing a semiconductor integrated circuit device according to claim 5 , wherein said adhesive layer is formed of a coated film.
7. A method of manufacturing a semiconductor integrated circuit device according to claim 5 , wherein said adhesive layer is formed by a CVD (chemical vapor deposition) method.
8. A method of manufacturing a semiconductor integrated circuit device according to claim 5 , wherein said adhesive layer is silicified as a silicide layer by the heat treatment in the process for bonding said supporting substrate to said interconnection portion through said insulating layer after a metal film was deposited by a sputtering method.
9. A method of manufacturing a semiconductor integrated circuit device according to claim 5 , further comprising a process for decreasing a thickness of said semiconductor from the back side after said process for bonding said supporting substrate to said interconnection portion through said insulating layer.
10. A method of manufacturing a semiconductor integrated circuit device according to claim 5 , wherein said substrate is composed of a circuit element formed on a semiconductor substrate and an interconnection portion, having an interconnection layer in an insulating layer, formed on the surface side of said semiconductor substrate.